Abstract: A conditioning apparatus and method for conditioning a polish pad. The conditioning apparatus has a movable conditioning arm with a disk mounting apparatus, a plurality of interchangeable conditioning disks, a disk housing or multiple disk stations capable of holding the plurality of interchangeable conditioning disks and a controller for directing and controlling the movement of said conditioning arm.
Type:
Grant
Filed:
March 29, 2002
Date of Patent:
August 3, 2004
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Abstract: A method of fabricating a polishing pad in which a pad material includes a polishing layer overlying a substantially optically transparent backing layer is subjected to a process in which an optical window is formed in the pad material by removing a portion of the polishing layer and exposing an underlying portion of the substantially optically transparent backing layer. Prior to forming the optical window, the polishing layer is bonded to the backing layer to form a sealed interface, then a portion of the polishing layer is mechanically cut away from the backing layers. Since the backing layer is not pierced during the removal process, a liquid, such as an aqueous polishing slurry, cannot leak through the optical window and on to underlying portions of a polishing apparatus to which the pad material is mounted.
Abstract: A polishing pad includes a polishing layer and an adhesive layer. An adhesive bottom surface of the adhesive layer has an air transmitting pathway to collect air that is expelled from under the adhesive bottom surface, which avoids entrapment of air under the adhesive bottom surface.
Type:
Grant
Filed:
September 13, 2000
Date of Patent:
March 2, 2004
Assignee:
Rodel Holdings, Inc.
Inventors:
Arthur Richard Baker, III, Steven Fetheroff
Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Type:
Grant
Filed:
November 10, 2000
Date of Patent:
January 27, 2004
Assignee:
Rodel Holdings, Inc.
Inventors:
John H. V Roberts, David B. James, Lee Melbourne Cook
Abstract: This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.
Type:
Grant
Filed:
February 2, 2001
Date of Patent:
January 20, 2004
Assignee:
Rodel Holdings, INC
Inventors:
Barry Scott Pinheiro, Steven Naugler, Mary Jo Kulp
Abstract: A polishing composition for polishing a semiconductor substrate has a pH of under 5.0 and comprises
(a) a carboxylic acid polymer comprising polymerized unsaturated carboxylic acid monomers having a number average molecular weight of about 20,000 to 1,500,000 or blends of high and low number average molecular weight polymers of polymerized unsaturated carboxylic acid monomers,
(b) 1 to 15% by weight of an oxidizing agent,
(c) up to 3.0% by weight of abrasive particles,
(d) 50-5,000 ppm (parts per million) of an inhibitor,
(e) up to 3.0% by weight of a complexing agent, such as, malic acid, and
(f) 0.1 to 5.0% by weight of a surfactant.
Type:
Grant
Filed:
April 12, 2002
Date of Patent:
January 20, 2004
Assignee:
Rodel Holdings, Inc.
Inventors:
Wesley D. Costas, Tirthankar Ghosh, Jinru Bian, Karel-Anne Valentine
Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.
Type:
Grant
Filed:
July 10, 2002
Date of Patent:
September 16, 2003
Assignee:
Rodel Holdings, INC
Inventors:
Peter W. Freeman, Marco A. Acevedo, Jon D. Jacobs, Jr.