Abstract: A multiple circuit board assembly includes stacks (50,52) of printed circuit boards each having a series of hermaphroditic edge connector nodes (46,46a, 82) that electrically connect a printed circuit board (56) of one stack to a plurality of boards of a second stack. Each board edge also includes a service cable connector (74) having electrical power and fiber optic input/output connector elements (161,163) that connect the board to a spring mounted service module connector receptacle (42) in a housing structure (16) that carries the assembled stacks of printed circuit boards.

Abstract: A multi-level substrate (24) for mounting and interconnecting a number of integrated circuit chips (10) is formed of a stack of laminated sheets each comprising a conductive circuit layer (30,34,38,42,46) is laminated to a dielectric film (32,36,40,44,48). The sheets are formed by fully additive or semi-additive processes on a reusable mandrel and are interconnected to one another by raised features (78) on the circuit layer of one sheet that project through a hole (86) in the dielectric film of an adjacent sheet to contact a receiving area (88) of the circuit layer of the adjacent sheet. Integrated circuit chips (10) and other electrical components are mounted to the uppermost sheet and electrically connected thereto by means of wiring bonding (16) or a f lip-chip arrangement (150) in which chip pads (148) rest upon and contact raised features (146) of the circuit layer (140) of the uppermost sheet.