Patents Represented by Attorney Eustus D. Nelson, Esq.

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  • Semiconductor chip assembly with flexible metal cantilevers
    Patent number: 7532475
    Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: May 12, 2009
    Assignee: International Business Machines Corporation
    Inventors: Bruno Michel, Thomas J. Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen, Urs Kloter