Abstract: Techniques are disclosed that facilitate fabrication of semiconductors including structures and devices of varying thickness. One embodiment provides a method for semiconductor device fabrication that includes thinning a region of a semiconductor wafer upon which the device is to be formed thereby defining a thin region and a thick region of the wafer. The method continues with forming on the thick region one or more photonic devices and/or partially depleted electronic devices, and forming on the thin region one or more fully depleted electronic devices. Another embodiment provides a semiconductor device that includes a semiconductor wafer defining a thin region and a thick region. The device further includes one or more photonic devices and/or partially depleted electronic devices formed on the thick region, and one or more fully depleted electronic devices formed on the thin region. An isolation area can be formed between the thin region and the thick region.

Abstract: A monolithic pumped laser cavity design is disclosed. Elements of the laser cavity, such as gain material, Q-switch, reflector, and outcoupler, are contact bonded together with a thermally conductive epoxy. The assembly is then operatively coupled to a heat sink (e.g., by mechanical or chemical means). The assembly is potted in thermally conductive potting material. The stacked elements or a subset thereof may be bonded to heat sink mounts and/or face cooling layers. In this fashion, various elements can be easily assembled and bonded together to provide the desired combination of laser energy, pulse width, and repetition frequency. The thermally conductive potting material provides structural integrity, as well as thermal management by extracting heat from the encased assembly to the heat sink. The optional heat sink mounts and face cooling operate to further extract heat and reduce thermal loading. Outcoupling to fiber may also be provided.

Abstract: A coat for use by emergency responders, such as firefighters, is described. Certain aspects of the coat include a barrier resistant liner for protection against chemical and biological agents, a compression zone that can improve safety when working in hazardous areas, and a flame resistant shell including zippered sleeves that can facilitate the donning of protective gloves.

Abstract: Techniques are disclosed that allow for programmable attenuation using thermometer code steps. By thermometer coding the attenuator structure, monotonicity is guaranteed or otherwise greatly improved, which eliminates instability problems with automatic gain control loops and without the need for compensation or trimming. In addition, the thermometer coding technique also greatly reduces phase discontinuity between adjacent gain states.

Abstract: Protective footwear for responders such as firefighters, civil defense, and defense workers is described. Different aspects include a boot with a flange for forming a vapor/liquid tight seal with trousers, methods of making the boot and methods of using the boot.

Abstract: The disclosure relates to a rotatable support for a beach chair that has a low profile, can be lightweight, is durable and may include a bearing that is resistant to sand. The support is easy to use, store and transport. It may be easily attached and removed from a beach chair.

Abstract: Techniques are disclosed for optical switching and data control, without the interaction of electronic switching speeds. In one example embodiment, a common cavity optical latch is provided that that can hold an optical state for an extended period of time, and the operation of which is controlled optically. Optical phase control allows optical modal switching to be employed between two common optical cavities, using incident optical signals and the way in which the cavities manipulate the phase within them to lock in one or the other configuration, thereby forming an optical latch. The optical latch is implemented in an integrated fashion, such as in a CMOS environment.

Abstract: Techniques are disclosed that facilitate fabrication of semiconductors including structures and devices of varying thickness. One embodiment provides a method for semiconductor device fabrication that includes thinning a region of a semiconductor wafer upon which the device is to be formed thereby defining a thin region and a thick region of the wafer. The method continues with forming on the thick region one or more photonic devices and/or partially depleted electronic devices, and forming on the thin region one or more fully depleted electronic devices. Another embodiment provides a semiconductor device that includes a semiconductor wafer defining a thin region and a thick region. The device further includes one or more photonic devices and/or partially depleted electronic devices formed on the thick region, and one or more fully depleted electronic devices formed on the thin region. An isolation area can be formed between the thin region and the thick region.

Abstract: Techniques are disclosed for determining the bearing from a three-axis geophone to a seismic source, such as a person or other man-made seismic source. In one embodiment, the techniques are implemented as a method that includes receiving outputs from a three-axis geophone (x axis, y axis and z axis outputs), computing a magnitude signal based on the x and y axis outputs, determining locations of each local peak in the magnitude signal, computing a bearing estimate for each peak, and computing a median of the bearing estimates. The resulting median bearing is an estimate of the bearing from the geophone to a target seismic source. In one such case, computing the magnitude signal based on the x and y axis outputs is performed in response to detecting the target seismic source in the phase-shifted z axis output.

Abstract: A compressive sensor array (CSA) system and method uses compressive sampling techniques to acquire sensor data from an array of sensors without independently sampling each of the sensor signals. In general, the CSA system and method uses the compressive sampling techniques to combine the analog sensor signals from the array of sensors into a composite sensor signal and to sample the composite sensor signal at a sub-Nyquist sampling rate. At least one embodiment of the CSA system and method allows a single analog-to-digital converter (ADC) and single RF demodulation chain to be used for an arbitrary number of sensors, thereby providing scalability and eliminating redundant data acquisition hardware. By reducing the number of samples, the CSA system and method also facilitates the processing, storage and transmission of the sensor data.

Abstract: A remote ordering system is provided using an electronic menu having a series of input devices corresponding to various menu items aligned with the input devices, and a wireless transmitter to send selected menu items to a receiving device for processing. A display to show selected menu items, an alpha-numeric keyboard, a non-cash payment device, and a printer for receipts are also contemplated for increased functionality.

Abstract: A ceramic composite and method of making are provided. The ceramic composite may be transparent and may serve as transparent armor. The ceramic portion of the composite may be single crystal sapphire. The composite may provide adequate protection from projectiles while exhibiting large surface areas and relatively low areal densities.

Abstract: Techniques for generating terahertz (THz) radiation are provided in which each nonlinear crystal in an array of such crystals is coupled to one or more corresponding waveguides such that any THz radiation generated in any single crystal is coupled into that crystal's THz waveguide structure. After the THz radiation is generated in the crystals and coupled into the waveguides, the individual THz signals may be coherently combined to form a single THz signal (non-coherent configurations are provided as well). Crystal-waveguide arrays embodying the techniques can be used to implement efficient, robust, and compact THz sources suitable for applications such as security screening, medical imaging, quality control and process monitoring in manufacturing operations, and package and container inspection.