Patents Represented by Attorney Finnegan, Henderson, Farabow, Garrett, & Henderson, L.L.P.

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  • Method and apparatus for chemical mechanical polishing
    Patent number: 7229341
    Abstract: A chemical mechanical polishing apparatus prevents scratches caused by a direct friction between a polishing pad and a wafer. The apparatus includes a polishing pad, in which grooves are regularly formed, for generating a dynamic pressure by rotation; a polishing table to which the polishing pad is adhered; a wafer provided at a predetermined interval from the polishing pad; a polishing head, on which the wafer is mounted, for driving the wafer; and a slurry supplier for providing slurry to a surface of the polishing pad.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: June 12, 2007
    Assignee: Dongbu Electronics Co., Ltd.
    Inventor: Jae Young Choi