Patents Represented by Attorney Finneganm Henderson, Farabow, Garrett & Dunner, L.L.P.
  • Patent number: 7078776
    Abstract: A semiconductor device has a first semiconductor region formed in a semiconductor substrate and having a first conductivity type due to first-conductivity-type active impurities contained in the first semiconductor region, and a second semiconductor region formed between the first semiconductor region and the surface of the semiconductor substrate and having a second conductivity type due to second-conductivity-type active impurities contained in the second semiconductor region. The second semiconductor region contains first-conductivity-type active impurities, whose concentration is zero or smaller than a quarter of a concentration of the second-conductivity-type active impurities contained in the second semiconductor region. An insulating film and a conductor are formed on the second semiconductor region. Third and fourth semiconductor regions of the second conductivity type are formed at the semiconductor surface in contact with the side faces of the second semiconductor region.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: July 18, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazumi Nishinohara, Yasushi Akasaka, Kyoichi Suguro
  • Patent number: 6607404
    Abstract: In the connector body, which has side portions for guiding the side surfaces of the IC card, a bottom portion having a support surface to support a front surface or back surface of the inserted IC card and stepped portions to engage the raised surface portion formed on the back surface so that the raised surface portion can be moved in an IC card , insertion/retraction direction, and a top plate portion disposed opposite the bottom portion to prevent the inserted IC card from floating upward; a leaf spring is provided to urge the IC card upward at a predetermined position with respect to the card insertion direction. The top plate portion has a blocking portion which engages the raised surface portion of the IC card at a predetermined blocking position and is disposed in front, with respect to the IC card insertion direction, of the predetermined position where the IC card is urged by the leaf spring.
    Type: Grant
    Filed: November 2, 2000
    Date of Patent: August 19, 2003
    Assignees: Yamaichi Electronics Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyasu Ito, Takashi Torii
  • Patent number: 6076968
    Abstract: A flexible pouch is formed from a first and second sheet which are in sealing engaged along their side edges. Two gussets are provided at the top and bottom, respectively, of the sheets. The bottom of the uppermost gusset is recessed such that a pocket is formed at one end of the pouch. A compartment is formed within the pouch by the two sheets and the two gussets. A straw or other suitable instrument can be used to puncture the uppermost gusset in order to remove the contents from the compartment of the pouch. This pocket has a wide mouth and will enable easy insertion of the straw while minimizing or eliminating product spillage.
    Type: Grant
    Filed: November 26, 1996
    Date of Patent: June 20, 2000
    Assignee: The Coca-Cola Company
    Inventors: James W. Smith, Abigail L. Rodgers, Thomas E. Riley, Jr., Mark W. Holmes