Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.

Abstract: An adjustable size hot plug assembly includes a frame, an actuator and at least one arm connected thereto. The arm includes an adjustable clip and a fixed clip to retain a printed circuit board. Where more than one arm is employed (preferably three are employed in the invention), the middle arm and one end arm are adjustable toward or away from one another and toward or away from the other end arm which may be fixed. The invention allows the hot plug assembly to be universal in that it can be adapted to fit any Peripheral Component Interconnect (PCI) card.

Abstract: A cold plate, planar in shape, is machined to provide an interior cavity having a plurality of thermally conductive members which transfer any thermal energy absorbed by the cold plate to a chilled water stream flowing through the interior cavity. Electronic cards are mechanically and thermally married to copper conduction plates which mount on a surface of the cold plate. The cold plate can hold up to nineteen pairs of conduction plate/electronic card assemblies. Thermal energy generated by the electronic circuit cards flows into the conduction plate and then into the chilled water stream flowing in cold plate. The chilled water is provided by a cooling system as known in the art. The cold plate also provides a large central through-hole through which the electronic cards are electrically connected to a computer system. The cold plate through-hole allows the cold plate to enjoy close proximity to the thermal source providing a path of high conductance for the thermal energy to be dissipated.

Abstract: A cold plate includes two flow-wise isolated coolant (or refrigerant) passages (or sets of passages) originating at the center of the cold plate and terminating at an edge for use in conjunction with separate refrigeration systems. The cold plate passages are centrally fed by the refrigeration system to create a cooling gradient radiating from the center of the cold plate to its edges. The center-fed cold plate provides a more even temperature gradient across the thermal source. The cold plate passages do not permit flow communication between distinct coolant (or refrigerant) paths. This permits two distinct cooling systems to operate either dually or in a redundant manner. Nonetheless, flow isolation is achieved while still maintaining tight thermal coupling between each path and the object, such as an electronic computer processor module, to be cooled.