Abstract: A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between the mounting device top and the board stiffener, wherein the heat sink device includes a top plate, a bottom plate and a heat sink fin compressingly disposed between the top plate and the bottom plate.

Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

Abstract: A method and apparatus for testing cooling units used in computers is presented. Testing of such cooling systems increases the reliability thereof, which in turn increases the reliability of the computers utilizing these cooling systems. The cooling system tester comprises a test frame which supports a plurality of evaporators, associated modular cooling units (units under test) and associated fan or blower assemblies. A heating element is attached to each of these evaporators to act as a heat load for the corresponding modular cooling unit, i.e., to simulate the heat load of an actual computer. The heat output of the heating elements are controlled by a computer. The power supplied to the modular cooling units is also regulated (controlled) by the computer. A program in the computer runs a test on each of the modular cooling units. The program checks for user input and the installation of a modular cooling unit.