Abstract: A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.
Type:
Grant
Filed:
October 12, 1999
Date of Patent:
May 22, 2001
Assignee:
International Business Machines Corporation
Inventors:
Sukhvinder Kang, Howard Victor Mahaney, Jr., Roger R. Schmidt, Prabjit Singh