Abstract: A method of integrally bonding a foam seat pad or other article to a cover material includes steps of positioning a two ply cover material in a set stand of a lower mold. The set stand positions a main surface portion of the cover material in a desired alignment while a retaining member is used for provisionally maintaining the alignment. Side mold portions are moved in position to firmly surround the set stand and and the retaining member is removed. Then, foam resin is introduced into the space defined by the set stand and side mold portions and an upper mold is used to sealingly cover the molding apparatus. After the upper mold is closed pressurization of the internal space of the molding apparatus is effected for a desired time during setting of the foam resin.
Type:
Grant
Filed:
October 26, 1994
Date of Patent:
November 24, 1998
Assignee:
Ikeda Bussan Co., Ltd.
Inventors:
Masanobu Kikuchi, Norio Yanagishita, Koji Yamada