Abstract: A switching power supply AC-DC-DC or AC-DC-AC with power factor corrector function is provided. The switching power supply circuit includes a quasi active shaping function that shapes an input current of a power line. In the whole system, the active switch or switches are only used to control the output power and no more current stress on the active switch or switches. It is possible to minimize the whole system size.

Abstract: A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die. The increase in the bonding metal area (101a) increases the number of interconnections between the metal area (101a) and the die (100) to reduce the electric resistance and inductance. Furthermore, the surface area of the external terminals radiating from the package's plastic body (106) is increased if not maximized so that heat can be dissipated quicker and external terminal resistances reduced. The integrated circuit is applicable for MOSFET devices and the bonding metal area (101a) is used for the source terminal (101). The bonding metal area may have a “L” shape, a “C” shape, a “J” shape, an “I” shape or any combination thereof.