Abstract: A method of manufacturing EL lamp systems is available which incorporates some of the processes used in manufacturing flexible, printed circuit boards with surface mounted components along with those used to form multilayered EL lamps. The EL lamp system produced by this method is suitable for a variety of graphics and low-cost consumer applications.

Abstract: A set of surgical instruments and a method for performing Keratorefractive eye surgery is disclosed. The set of surgical instruments includes two or more knife blades for making incisions of a precise depth in the cornea, and two or more footplate assemblies for holding each of the knife blades, the cutting portion of each knife blade extends from the footplate assembly by a precise fixed length corresponding to the precise depth of incision which can be made by that particular knife blade. Each footplate assembly includes a footplate which moves on the surface of the cornea to precisely control the depth of incision. Each footplate assembly also includes markers for indicating the range, fixed length and style of the knife blade, along with a handle for holding and manipulating each knife blade.

Abstract: A method for manufacturing low-cost electroluminescent (EL) lamps is disclosed. The method of the present invention includes the first step of die cutting, embossing or chemically etching a metal foil to form one or more rear capacitive electrodes. Next, the capacitive electrodes are bonded to a paper core stock which is coupled to a precisely positioned indexing system. In the third step, a layer of EL phosphor ink is applied to the capacitive electrodes to precisely form the areas of illumination. In step four, a layer of conductive ITO ink is applied to cover the layer of EL phosphor ink. Next, in step five a transparent polyester film or ultraviolet activated dielectric coating is applied to the entire surface of the lamp. Finally, in step six electrical terminations are provided to the rear capacitive electrode and the layer of conductive ITO ink.

Abstract: A method and apparatus for removing particle, metallic and organic contamination from the wafers used in fabricating integrated circuits is disclosed. In the preferred embodiment, the method comprises the step of placing the wafers to be processed in a vessel or container constructed of a very pure metal, and upon which a surface oxide will quickly form in air. The metal vessel or container is then filled with a cleaning solvent such as sulfuric acid, and are ultrasonically vibrated to remove the contamination. The ultrasonic vibration causes an acoustic streaming of the sulfuric acid, leading to a microflow of the solvent across the surface of the wafer at speeds on the order of several meters per second. This microflow provides for an quick and efficient cleaning of the wafer at reduced temperatures, thereby increasing the overall throughput of the planar fabrication process. The apparatus comprises a vessel or container constructed from a very pure metal, and containing an acidic cleaning solvent.