Abstract: There is disclosed thickened, low shrink curable molding compositions having reduced initial viscosity and the method of making the same. The low shrink, curable thermosetting compositions have a thermoplastic low profile additive and viscosity reducing agent incorporated therein, said thermoplastic low profile additive being a vinyl acetate polymer, a saturated polyester or mixtures thereof and said viscosity reducing agent being an aliphatic monocarboxylic acid having at least 6 carbon atoms in the chain.