Patents Represented by Attorney Frederic B. Luludis

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  • Heat sink assembly employing spring-loaded standoffs
    Patent number: 5757621
    Abstract: A heat sink may be shared among a plurality of electronic devices attached to a printed circuit board by attaching the heat sink to the printed circuit board using a plurality of standoff/spring combinations. In this way, the level of compression imposed by the springs on the heat sink allows the heat sink to make the appropriate level of thermal contact with the electronic devices.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: May 26, 1998
    Assignee: Lucent Technologies Inc.
    Inventor: Naresh C. Patel