Abstract: A wafer of semiconductor material has plural dies formed on the wafer with scribe-line areas of semiconductor material around the each die. Each die includes functional circuitry having input and output bond pads and the dies are arranged adjacent one another in a regular array. Each die includes selectable internal connecting leads connecting the input and output bond pads along one side of the die and the input and output bond pads along an opposite side of the die. External connecting leads are formed on the wafer in the scribe-line areas. The external connecting leads connect input and output bond pads of one die and input and output bond pads of an adjacent die. There is one external lead connecting one bond pad on one die with one corresponding bond pad on the adjacent die.