Abstract: A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).

Abstract: A bandpass filter and a method for making a bandpass ladder filter having a center frequency, a first port and a second port. The method has steps of providing a first L network having a first connection, a second connection and an inductive impedance at the center frequency and providing a second L network having a first connection, a second connection and a capacitive impedance at the center frequency. The method further has steps of coupling the first connection of the first L network to the first port, coupling the first connection of the second L network to the second connection of the first L network and coupling the second connection of the second L network to the second port.

Abstract: An electronic apparatus for receiving and filtering high frequency waves comprises a sequence of T electro-acoustic transducers each having multiple interdigital electrode fingers and a centerline located equidistant between its outermost electrode fingers. For a centerline-to-centerline distance of a first adjacent pair of transducers D.sub.1, and centerline-to-centerline distances of other adjacent pairs of transducers D.sub.2 to D.sub.T-1, then at least some of D.sub.2 to D.sub.T-1 differ from D.sub.1 by a non-integral number of wavelengths. The transducer array is symmetrical about a centerline and the number of fingers in each transducer varies, with an input or output transducer closer to either end of the sequence having more fingers than a like kind transducer nearer the center.

Abstract: An apparatus for providing electronically tunable biphase modulation. The apparatus includes an input for supplying a signal to be modulated and a coupler including first, second, third and fourth ports. The first port is coupled to the input. The apparatus also includes a first switch coupled to the second port. The first switch operates in response to a modulating signal. The apparatus further includes a first reactance element coupled to the first switch, an output coupled to the third port, a phase-shifting network coupled to the fourth port, a second switch coupled to the phase-shifting network and a second reactance element coupled to the second switch. The second switch operates in response to a modulating signal.

Abstract: A digital single sideband modulator (10) includes a relatively complex CMOS NCO (14) that drives a relatively simple ECL frequency translator (30). The frequency translator (30) outputs a digital signal that is converted to analog by a D/A (44) and then filtered in a bandpass filter (46) having a pass band including a frequency of twice the NCO's clock frequency. The NCO (14) generates a modulated intermediate frequency NCO signal having quadrature components. The frequency translator (30) multiplies real and imaginary components of the NCO signal by real and imaginary components of digitized SIN, COS sampling functions (48, 50). The resulting products are added together. The adding operation is performed by a multiplexer (32), whose selection input is driven at twice the carrier frequency, and the multiplying operations are performed by a selective negation circuit (34), that is driven at the carrier frequency.

Abstract: An apparatus for providing electronically tunable biphase modulation including an input and a first switch having a first output, a second output and a first input coupled to the input. The first switch couples the first input to either the first output or to the second output in response to a modulating signal. The apparatus also includes a first signal path having a first phase shift and a second signal path having a second phase shift different than the first phase shift. The first signal path is coupled to the first output and the second signal path is coupled to the second output. The apparatus also includes a second switch having a first input coupled to the first signal path, a second input coupled to the second signal path and a terminal output.

Abstract: An acoustic wave filter with reduced bulk-wave scattering loss has a center frequency and an associated acoustic wavelength. The filter includes a substrate and a first reflector having a first group of periodically disposed reflective elements. The filter includes a first transducer on a first side of the first reflector. The filter also includes a first gap having a first width, located between the first reflector and the first transducer. The first width exceeds one-fourth of the acoustic wavelength. The filter includes a second reflector and a second gap disposed between the first transducer and the second reflector. The second gap has a second breadth exceeding one-fourth of the acoustic wavelength. A first waveguiding element is positioned within the first gap and having a first breadth. The first width exceeds the first breadth.

Abstract: A transponding tag (14) and method for responding with a unique code signal (18) when it receives an interrogation signal (16). The tag (14) waits a random duration before responding to avoid interference with response code signals (18) from other tags (14). The tag (14) includes two antennae (22, 24) formed on opposing sides of a dielectric planar substrate (20). A protective coating (52) and printed indicia (72) overlie the antennae. An electrical circuit (34), decoupling capacitor (44) and inductive pickup coil (46) are embedded within the substrate (20). The electrical circuit (34) and capacitor (44) reside between the antennae (22, 24) to receive RF shielding from the antennae and to reduce thickness of the tag (14). A capacitance exists between the antennae (22, 24). This capacitance stores DC electrical energy for the electrical circuit (34). The tag (14) is programmed through a modulated magnetic field detected at the inductive pickup coil (46).

Abstract: A method and apparatus for switching data between a selected pair of data processing elements. The method involves steps of sending a first service request signal from a first data processing element to a switch, where the first service request signal includes a first destination, sending a first data message to the switch and storing the first service request signal and the first data message at least temporarily in a first buffer memory. The method further involves steps of routing the first data message to the first destination and initiating communication between the first data processing element and the first destination.

Abstract: A radio frequency apparatus desirably includes at least one microelectronic device comprising a substrate including the at least one microelectronic device and a package base for mounting the microelectronic device. The package base includes external interconnections coupled to internal interconnections and an adhesive affixing the substrate to the package base. The adhesive is disposed along a first axis of the substrate. The internal interconnections are coupled to the microelectronic device. A lid is sealed to the package base. The lid seals the microelectronic device.

Abstract: A communication and processing system (10) monitors signals transmitted from personal transmitter units (PTUs 20) to determine whether alarm or emergency conditions have occurred and whether scheduled communications from PTUs (20) are missing. The PTUs (20) detect various alarm and emergency conditions and transmit data communications to a field node (18). The field node (18) receives data communications from all PTUs (20) within range. If a data communication indicates an emergency condition, a field report message is immediately sent to a control facility (12). If a communication indicates an alarm condition, an audible alarm is sounded at the field node but no message is sent to the control facility yet. If the alarm condition is not corrected within a predetermined period of time, a message describing the alarm condition is sent to the control facility (12). When scheduled communications from a PTU (20) are not received at the field node (18), the situation is treated as an alarm condition.

Abstract: An apparatus (105, 301) for enclosing a microfabricated component (225) includes a package base (120, 405, 910), a package lid (110, 510, 950) and a seal (215) coupled to the package base (120, 405, 910) and to the package lid (110, 510, 950). The apparatus (105, 301) further includes a conductive loop (210, 610, 920) thermally coupled to the seal (215). Electrical energy is supplied to the conductive loop (210, 610, 920) to heat the conductive loop (210, 610, 920) and seal (215) to melt the seal (215) and thereby to seal the package base (120, 405, 910) to the package lid (110, 510, 950), providing a sealed environment for the microfabricated component (225).

Abstract: A dynamically configurable switched capacitor power supply and a method for operation thereof. The power supply includes a first dynamically adjustable switched capacitor network having a first input, a first output and including a first plurality of n many switched capacitors. The first input is adapted to be coupled to a power source. The first dynamically adjustable switched capacitor network provides a step-up or step-down power supply regulation function in response to first control signals. The power supply includes a control network having an error detector coupled to the first output, an oscillator for providing a clocking signal, an analog to digital conversion circuit for providing a digital representation of a voltage of the power source and control logic for providing the first control signals in response to the clocking signal and in response to signals from the error detector.

Abstract: A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).

Abstract: A HACT device employing a thin-film overlay of a more strongly piezoelectric material can operate as a delay line and as a tapped delay line, or transversal filter, while requiring less total power for the SAW clock signal. The increased electrical potential per unit total SAW power thus realized facilitates coupling between the total SAW energy and the mobile charge carriers. Some materials systems, such as a GaAs substrate and a ZnO thin-film overlay, will require an intervening thin-film dielectric layer in between the HACT substrate and epitaxial layers and the thin-film piezoelectric overlay. This may be necessitated by chemical, semiconductor device processing, or adhesion incompatibilities between the substrate material and the thin-film overlay material.

Abstract: An encapsulated microelectronic device (100) including a base (101) and a semiconductor device (305) having a top and a bottom. The bottom is attached to the base (101). The semiconductor device (105) has a thickness in the range from one-fourth to three-fourths of a millimeter and has a bottom metallization consisting of aluminum (407)/chromium (405)/nickel (403)/gold (401). The semiconductor device (305) has a contact (115) attached to the top. The encapsulated microelectronic device (100) has a molded top (120) surrounding the semiconductor device (305). The molded top (120) is made from low stress molding material.

Abstract: An apparatus is described which comprises a rigid element having a length greater than a distance separating gunwales of a boat and a pair of notched elements disposed to either end of the rigid element. The notched elements are adapted to releasably engage the gunwales. The pair of notched elements are held by spring action of the gunwales and sides of the boat when the pair of notched elements are engaged with the gunwales.

Abstract: A frequency selective component and a method for making a frequency selective component. The frequency selective component includes a substrate having at least a first surface and an acoustic impedance transformer coupled to the substrate. The acoustic impedance transformer transforms an acoustic impedance of the substrate to a second acoustic impedance. The acoustic resonator further includes a mechanical resonator disposed on the acoustic impedance transformer. The acoustic resonator provides a frequency selection function.

Abstract: Orbiting satellites (12) project footprints (30) on the earth. Each footprint (30) is divided into cells (28). Footprints (30) of nearby satellites (12) overlap one another, and the overlap increases as satellites (12) approach a pole from the equator. Positions of all cells (28) generated by all satellites (12) are simulated (36) at numerous points throughout an orbit. Channel sets are assigned to cells (28) within a reference footprint (30a). This assignment is propagated throughout all footprints (30) except for those footprints (30) residing adjacent one side of a seam (16) between orbits (14) where satellites (12) travel in opposing directions. The channel sets are assigned near the seam (16) in response to previously assigned channel sets. Each satellite (12) stores channel set assignments for its cells (28) at various points throughout its orbit. All satellites (12) switch their communication parameters simultaneously in response to the channel set assignments.