Abstract: An aluminum foil has, sputtered upon it, a foil of tungsten, upon which a foil of gold is sputter deposited. The gold foil may be placed next to a gold substrate, and the three-foil combination bonded to the substrate with a stylus, upon which ultrasound is impressed, in the presence of a moderately elevated temperature. An aluminum region the size of the tip of the stylus is thus made available for an aluminum wire to be bonded to it, without any direct contact between the aluminum wire and the gold substrate.
Type:
Grant
Filed:
October 15, 1990
Date of Patent:
December 31, 1991
Assignee:
Rockwell International Corporation
Inventors:
John W. Slemmons, Francis J. Woolston, Patrick J. Redmond