Abstract: A method for fabricating point contacts to the rear surface of a silicon solar cell by coating the rear surface with a masking layer and a laser absorptive layer and directing laser radiation to the rear surface to form openings therein after which doping material is applied through the openings and contacts are applied. The doping is preferably performed by plasma immersion ion implantation.

Abstract: Test circuitry is incorporated on a chip die together with a circuit to be tested, such as an ASIC or microprocessor, to provide external access to signals that are internal to an integrated circuit chip package. A controller provides the arm command and issues appropriate configuration controls to collect signal samples. In particular, a network responds to these commands from the controller to selectively provide signal samples from a device under test. A trigger event generator responds to logic or other characteristics of the signal samples to provide trigger events. These trigger events are counted by a trigger event counter in the armed state of the state machine to identify the final trigger event corresponding to an occurrence of a programmable number of the trigger events. A store event generator also responds to a programmed characteristic or combination(s) of the signal samples to provide a store event. Either or both of the event generators may use a mask to provide these events.

Abstract: A window-type semiconductor package and a fabrication method thereof are provided. A substrate having an opening is mounted with at least a chip in a manner that, a conductive area of an active surface of the chip is exposed to the opening, and electrically connected to the substrate by bonding wires formed through the opening. A non-conductive material is applied over the conductive area of the chip. An upper encapsulant is formed to encapsulate the chip, and a lower encapsulant is formed to encapsulate the bonding wires and the non-conductive material. The non-conductive material interposed between the chip and the lower encapsulant helps prevent the chip from cracking at end portions thereof due to shrinkage of the lower encapsulant, and also helps secure the bonding wires in position within the opening of the substrate without causing wire-sweeping, such that reliability and yield of the semiconductor package can be assured.

Abstract: An image reading apparatus that includes an image scanning module in which an image sensor device is provided. The image reading apparatus includes an upper housing and a pattern located on the bottom surface of the upper housing and positioned at a position x with reference to the edge of the opening. The upper housing has a bottom surface and is provided with an opening for mounting a transparent platen adapted for supporting a document to be scanned. The opening defines an edge. Responsive to detection of the pattern by the image sensor device, the image reading apparatus determines the distance required to move by the scanning module to reach a predetermined positioning line.

Abstract: A disk player is provided to include a tray and a chassis, a traverse and an elastic device. Responsive to an instruction from a user, the tray selectively feeds in and ejects out. The chassis defines an inner side wall and inner bottom wall with the inner side wall extending out at a predetermined location to form a first protrusion and with the inner bottom wall extending out at another predetermined location to form a second protrusion. The first protrusion and second protrusion together defines a space. A traverse has a bracket on which a V-shaped retainer is provided with a first end thereof connected to one end of the bracket. The V-shaped retainer and the first protrusion define a slot in which the elastic device is disposed. The elastic device presses the V-shaped retainer and the first protrusion such that the vibration of the bracket during operation of the disk player is lowered.