Abstract: An independent dual-blade robot assembly is provided for use in semiconductor wafer processing. The robot assembly includes a rotatable stage located within a chamber, a linear track mounted on an upper surface of the rotatable stage, and article first and second motorized platens slidably mounted on the linear track and configured for movement along a longitudinal axis of the linear track. Each motorized platen is magnetically driven and carries an end effector which extends from a leading edge. The end effectors of the first and second motorized platens are preferably horizontally coplanar. The linear track may be a single track carrying both motorized platens, or two linear track sections may be provided where each carries a single motorized platen. The two track sections may be pivotally or rotatably connected to the rotatable stage.