Abstract: The disclosure involves a method for calibrating a system for determining thermal conductivity, k, and specific heat, c.sub.p of a fluid of interest. A proximately positioned heater and sensor are in thermal communication through a fluid of interest, and determinations are based on transient and steady-state temperature responses of the sensor to energy input in the heater. Calibration of the precise relations for each such system are determined by derivation using species of known physical property values.
Abstract: A thin film, solid state device includes a conductive thin film formed on a substrate, with a resistive layer overlying the conductive thin film and with electrical contacts formed on the upper surface of the resistive layer. Electrical current flows between the electrical contacts through the resistive overlayer and the conductive thin film. The resistivity and dimensions of the resistive layer are such that, preferably, only a small fraction of any current flowing between the electrical contacts will flow solely within the resistive layer, yet the magnitude of the current will not be reduced below a desired signal level due to the presence of the resistive layer. The resistive layer is comprised of material which will not diffuse into the thin film conductive layer during device processing. Nitrogen doped tantalum is the preferred material for the resistive layer.
Abstract: Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at least one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.
Type:
Grant
Filed:
November 21, 1988
Date of Patent:
April 23, 1991
Assignee:
Honeywell Inc.
Inventors:
Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks, Jerald M. Loy
Abstract: A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A removable non-wettable by solder frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
Type:
Grant
Filed:
February 10, 1989
Date of Patent:
December 25, 1990
Assignee:
Honeywell Inc.
Inventors:
Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks