Abstract: A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.

Abstract: Conformable marking sheet comprising a microporous thermoplastic polymer base sheet having a network of interconnected pores. The marking sheet has a low yield stress, making it conformable to rough surfaces. The pores of the base sheet can be filled with a diluent (wax) or they may have the diluent removed, for example by extraction. The construction may further comprise an adhesive on the bottom and a top marking indicium layer comprising a polymeric binder in which is partially embedded a multiplicity of retroflective lens elements, e.g., transparent microspheres.