Abstract: An arrangement for testing electric samples, such as, circuit components, circuit assemblies, and circuit cards having a plurality of probe contact points. An electromagnetic holding plate is provided on which several testing heads of the same and/or different probe contact point configuration are releasably mounted. The individual testing heads are arranged on the holding plate in accordance with the respective configuration of the sample. Each of the testing heads contains a number of testing tips which are adapted to the configuration of the probe contact points of their associated parts of the sample. The testing heads are connected to a suitable control unit which provides supply voltage and test pulses.

Abstract: A package assembly which combines metallized ceramic technology and printed circuit board multilayer technology. A plurality of modules on a metallized ceramic substrate have closely spaced pins, for example, on 50 mil centers or grid, are plugged into a complex high precision multilayer printed circuit carrier. The pins are staggered in height with the longer pins having a relatively wide spacing, for example, on 100 mil centers or grid. The longer pins protrude through the high precision carrier and plug into a normal relatively simple and low cost printed circuit card or planar package.