Abstract: A scalable multi-power integrated circuit package for integrated circuits having spaced apart first, second and third pluralities of respective spaced apart chip power bonding pads connected to-corresponding first, second, and third chip power supply nets, the chip power bonding pads disposed adjacent to a chip periphery defining the chip area, the scalable multi-power integrated circuit package comprising: a central chip mounting area for mounting one of said integrated circuits, said chip mounting area defining a chip mounting area periphery surrounding said chip mounting area; spaced apart first, second and third package power supply continuous conductive traces, each trace disposed adjacent to the chip area mounting periphery; corresponding first, second and third pluralities of spaced apart package bonding areas defined along each respective one of said first, second and third package power supply continuous conductive traces, each respective one of said package bonding areas disposed in bondable alignme