Abstract: A ball grid array for a multilayer ceramic package 500 is disclosed. Package 500 contains dielectric multilayer substrates 502 having transmission lines 504 deposited therebetween and at least a first of the substrates having receptacles 506 therein each complementarily configured to respectively receive a set of solder balls 508. Contacts 510 within the receptacles 506 connect transmission lines 504 to solder balls 508. Terminal pads 512 are deposited on a base substrate 514 substantially in registration and aligned with the solder balls 508 to define an electrical interconnection. A method of manufacturing a multilayer ceramic package 500 with a ball grid array is also disclosed which involves orienting package 500 so receptacles 506 face upward and flooding a major surface with solder balls 508. Subsequently, solder balls 508 that did not enter receptacles 506 are removed resulting in a low profile package with minimum height above a circuit board.