Patents Represented by Attorney, Agent or Law Firm Gath M. Nath
  • Lead-free solder
    Patent number: 6416883
    Abstract: A lead-free solder composition comprising: 20 to 30 wt. % bismuth, 1.0 to 3.0 wt. % silver, 0.01 to 2.0 wt. % copper, 0.01 to 4.0 wt. % antimony and incidental impurities, the balance being tin.
    Type: Grant
    Filed: January 3, 2000
    Date of Patent: July 9, 2002
    Assignee: Ecosolder International Pty Ltd
    Inventor: Ian Noel Walton