Abstract: A pre-cure resistant liquid phenol-formaldehyde resin binder composition having low viscosity and low surface tension for efficient spray application as fine droplets in waferboard manufacture comprising a highly condensed and cross-linkable phenol-formaldehyde resin of relatively high average molecular weight and a non-resinous methylolated phenol condensate having an average molecular weight of 200-300.
Type:
Grant
Filed:
September 30, 1981
Date of Patent:
February 21, 1984
Assignee:
The Borden Chemical Company (Canada) Limited