Patents Represented by Attorney Gerald K. Kita
  • Patent number: 7270762
    Abstract: The polishing composition of this invention is useful for chemical-mechanical polishing of substrates containing noble metals such as platinum and comprises up to about 50% by weight of a adjuvant wherein said adjuvant is s elected from a group consisting of a metal-anion compound, a metal-cation compound or mixtures thereof; abrasive particles at about 0.5% to about 55% by weight of the polishing composition; and water-soluble organic additives up to about 10% by weight of the polishing composition. The abrasive particles are selected from the group consisting of alumina, ceria, silica, diamond, germania, zirconia, silicon carbide, boron nitride, boron carbide or mixtures thereof. The organic additives generally improve dispersion of the abrasive particles and also enhance metal removal rates and selectivity for metal removal by stabilizing the pH of the polishing composition and suppressing the dielectric removal rate.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: September 18, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Hongyu Wang, Terence M. Thomas, Qianqiu Ye, Heinz F. Reinhardt, Vikas Sachan
  • Patent number: 6899611
    Abstract: A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: May 31, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry George McClain, William D. Budinger, Elmer William Jensen
  • Patent number: 6860793
    Abstract: A polishing pad includes a polishing layer, and the transparent window portion of the polishing layer having dispersed particles to increase the rate at which the window portion wears away during a polishing operation, and to avoid forming a lump in the polishing layer.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: March 1, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: William D. Budinger, Naoto Kubo
  • Patent number: 6830090
    Abstract: A polishing pad installation tool comprised of a base portion and at least one compressible layer in operative connection with the base portion. The compressible layer includes a plurality of apertures through an upper surface of the compressible layer. The tool further includes a plurality of parallel pins extending outwardly from the base portion through the apertures of the compressible layer. Each of the pins includes a collar portion in surrounding relation about each pin. When the compressible layer is in an uncompressed condition, the collar portions are beneath the upper surface of the compressible layer. The pins are positioned on the base portion in a pattern which corresponds to the holes in the polishing platen. The pins have diameters which are smaller than the diameters of the holes in a polishing pad. The collars have diameters larger than the diameters of the holes in the polishing pad.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: December 14, 2004
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Bernard Foster
  • Patent number: 6769968
    Abstract: A conditioning apparatus and method for conditioning a polish pad. The conditioning apparatus has a movable conditioning arm with a disk mounting apparatus, a plurality of interchangeable conditioning disks, a disk housing or multiple disk stations capable of holding the plurality of interchangeable conditioning disks and a controller for directing and controlling the movement of said conditioning arm.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: August 3, 2004
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Joseph K. So
  • Patent number: 6722249
    Abstract: A method of fabricating a polishing pad in which a pad material includes a polishing layer overlying a substantially optically transparent backing layer is subjected to a process in which an optical window is formed in the pad material by removing a portion of the polishing layer and exposing an underlying portion of the substantially optically transparent backing layer. Prior to forming the optical window, the polishing layer is bonded to the backing layer to form a sealed interface, then a portion of the polishing layer is mechanically cut away from the backing layers. Since the backing layer is not pierced during the removal process, a liquid, such as an aqueous polishing slurry, cannot leak through the optical window and on to underlying portions of a polishing apparatus to which the pad material is mounted.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: April 20, 2004
    Assignee: Rodel Holdings, INC
    Inventor: Kyle W. David
  • Patent number: 6699104
    Abstract: A polishing pad includes a polishing layer and an adhesive layer. An adhesive bottom surface of the adhesive layer has an air transmitting pathway to collect air that is expelled from under the adhesive bottom surface, which avoids entrapment of air under the adhesive bottom surface.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: March 2, 2004
    Assignee: Rodel Holdings, Inc.
    Inventors: Arthur Richard Baker, III, Steven Fetheroff
  • Patent number: 6685757
    Abstract: A polishing composition for polishing a semiconductor wafer includes comprises water, an abrasive that is preferably colloidal silica, water-soluble cellulose having a molecular weight of at least about 1,000,000 and an alkaline compound that is preferably ammonia. Tetra methyl ammonium hydroxide may also be added to the polishing composition.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: February 3, 2004
    Assignee: Rodel Holdings, Inc.
    Inventors: Haofeng Xu, John Quanci
  • Patent number: 6679928
    Abstract: A polishing composition for polishing a semiconductor substrate has a pH of under 5.0 and comprises (a) a carboxylic acid polymer comprising polymerized unsaturated carboxylic acid monomers having a number average molecular weight of about 20,000 to 1,500,000 or blends of high and low number average molecular weight polymers of polymerized unsaturated carboxylic acid monomers, (b) 1 to 15% by weight of an oxidizing agent, (c) up to 3.0% by weight of abrasive particles, (d) 50-5,000 ppm (parts per million) of an inhibitor, (e) up to 3.0% by weight of a complexing agent, such as, malic acid, and (f) 0.1 to 5.0% by weight of a surfactant.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: January 20, 2004
    Assignee: Rodel Holdings, Inc.
    Inventors: Wesley D. Costas, Tirthankar Ghosh, Jinru Bian, Karel-Anne Valentine
  • Patent number: 6679769
    Abstract: This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: January 20, 2004
    Assignee: Rodel Holdings, INC
    Inventors: Barry Scott Pinheiro, Steven Naugler, Mary Jo Kulp
  • Patent number: 6676718
    Abstract: According to the invention, an aqueous polishing composition comprises, abrasive particles and water of basic pH to remove a barrier layer by CMP using a polishing pad, the aqueous polishing composition further comprising, solely polar molecules each having multiple, polar bonding sites forming respective hydrogen bonds with silanol bonding groups on a hydrated silica dielectric layer of a semiconductor substrate, which form an hydrophilic protective film of the polar molecules that minimizes erosion.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: January 13, 2004
    Assignee: Rodel Holdings, Inc.
    Inventors: Qiuliang Luo, Qianqiu Ye, Kelly H. Block
  • Patent number: 6664188
    Abstract: A semiconductor wafer adapted for planarization by polishing the wafer with a polishing pad and a polishing fluid, the wafer having a metal layer, and a resistant film formed selectively on low topography features of the metal layer to resist the polishing fluid while high topography features of the metal layer are removed by said polishing, which minimizes a time duration for attaining planarization of the wafer by said polishing.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: December 16, 2003
    Inventor: Terence M. Thomas
  • Patent number: 6641631
    Abstract: An aqueous polishing composition having abrasive particles of a metal oxide has a pH that undergoes pH drift, because ions are provided by dissolution of the metal oxide, and the pH drift is minimized by providing the aqueous polishing composition with an equilibrium concentration of the ions at said pH.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: November 4, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Terence M. Thomas, Craig D. Lack, Steven P. Goehringer
  • Patent number: 6623337
    Abstract: The invention is directed to a base-pad for placement under a polishing pad for use with a polishing fluid during a polishing operation, the base-pad having a layer with vertical elongated pores that absorb polishing fluid and that confine absorbed polishing fluid from transport laterally in the base-pad. Micropores in the layer are impermeable to the polishing fluid and permeable to gasses.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: September 23, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Diane B. Scott, Arthur Richard Baker, III, Tao Zhang
  • Patent number: 6616717
    Abstract: A composition is provided in the present invention for polishing a composite semiconductor structure containing a metal layer (such as tungsten, aluminum, or copper), a barrier layer (such as tantalum, tantalum nitride, titanium, or titanium nitride), and an insulating layer (such as SiO2). The composition comprises an aqueous medium, an oxidant, an organic polymer that attenuates removal of the oxide film. The composition may optionally comprise a complexing agent and/or a dispersant.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: September 9, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Vikas Sachan, Elizabeth A. (Kegerise) Langlois, Qianqiu (Christine) Ye, Keith G. Pierce, Craig D. Lack, Terence M. Thomas, Peter A. Burke, David Gettman, Sarah Lane
  • Patent number: 6605537
    Abstract: A method of polishing a semiconductor substrate by adjusting the polishing composition with a BTA concentration that raises the metal removal rate when polishing at a relatively high polishing pressure, and that minimizes the metal removal rate when polishing metal in trough at a lower polishing pressure; and adjusting the polishing pressure on metal in each trough to a level that removes metal from trough at a minimized removal rate, while simultaneously polishing the excess metal with a higher polishing pressure.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: August 12, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Jinru Bian, Tirthankar Ghosh, Terence M. Thomas
  • Patent number: 6602436
    Abstract: A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: August 5, 2003
    Assignee: Rodel Holdings, Inc
    Inventors: Glenn C. Mandigo, Ross E. Barker, II, Craig D. Lack, Ian G. Sullivan, Wendy B. Goldberg
  • Patent number: 6561891
    Abstract: A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: May 13, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Stanley E. Eppert, Jr., Adam Manzonie, Peter W. Freeman, Elizabeth A. Langlois
  • Patent number: 6544307
    Abstract: A polishing compound containing cocoon-shaped silica particles and crystal silica particles, and water-soluble polymers including; at least one type selected from the groups including ammonium nitrate and ammonium acetate, and at least one type selected from methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, and the group including carboxymethylcellulose.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: April 8, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Hajime Shimamoto, Shoji Ichikawa, Katsumi Kondo, Susumu Abe, Kenji Takenouchi
  • Patent number: 6524168
    Abstract: An aqueous polishing composition for chemical mechanical polishing of semiconductor devices of silica and circuits of aluminum, titanium or titanium nitride; wherein said aqueous composition includes, an oxidizing agent, an inhibitor of a polyalkyleneimine, and a pH buffer, and a method for polishing a semiconductor device by applying the polishing composition at an interface between a polishing pad and the semiconductor device.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: February 25, 2003
    Assignee: Rodel Holdings, Inc
    Inventors: Qiuliang Luo, James Shen