Abstract: This invention describes improved polishing pads useful in the manufacture ofsemiconductor devices or the like. The pads of the present invention may have an advantageous hydrophilic polishing material and are sufficiently thin to generally improve predictability and polishing performance.
Type:
Grant
Filed:
February 8, 2002
Date of Patent:
December 31, 2002
Assignee:
Rodel Holdings, Inc.
Inventors:
David B. James, Lee Melbourne Cook, Arthur Richard Baker
Abstract: A polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window.
Type:
Grant
Filed:
September 28, 2000
Date of Patent:
March 19, 2002
Assignee:
Rodel Holdings, Inc.
Inventors:
Peter W. Freeman, Stanley E. Eppert, Jr., Alan H. Saikin, Marco A. Acevedo
Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and are sufficiently thin to generally improve predictability and polishing performance.
Type:
Grant
Filed:
January 21, 2000
Date of Patent:
March 12, 2002
Assignee:
Rodel Holdings Inc.
Inventors:
David B. James, Lee Melbourne Cook, Arthur Richard Baker