Abstract: A fiber optic module connector system comprising a quick connect and disconnect optical terminator having several signal channels and an optically terminated module with a built-in retention system for its mating connector. Fiber optic signal lines are rapidly connected directly to light emitting diodes mounted on an integrated circuit chip in the module.

Abstract: An integrated circuit module to printed circuit board interconnection system wherein the board has circuit pads to which spring contacts have one of their ends soldered to the pads. The module has circuit pads on one surface thereof and a pivotal connection is provided for loading the module onto the circuit board whereby the opposite ends of the spring contacts engage the circuit pads on the module with a wiping action and are retained in engagement therewith.

Abstract: Electronic signals which are converted to light signals by means of a light emitting diode or laser diode are channeled through a fiber optic group and enter a rotary fiber optic switch. A rotatable drum channels and distributes the light signals to intended output locations by means of light conductive elements in the drum. Selecting the desired position of the drum by means of a detent switch or by mechanically rotating the drum by a light actuated mechanism determines the channel orientation of the device. The output signals emerge from the light conductive elements in the drum and are transmitted through output fiber optic groups to a photo diode or photo transistor where they are converted into electronic signals for normal electronic I/O processing.

Abstract: A method of detecting flaws in a printed circuit board laminate having drilled holes wherein a penetrating solution containing a UV fluorescing dye is applied to the laminate to fill the drilled holes and flaws. Excess penetrating solution is removed from the drilled holes and the surface of the laminate. The penetrating solution remaining in the flaws is cured into an insoluble solid and then the laminate is cross-sectioned to provide at least one sample carrying the cured solution. The sample is encapsulated in a clear epoxy and the encapsulated sample is ground and polished to provide a surface which is examined under UV light.

Abstract: A neutralization process is provided for neutralizing chloride ions in etched via holes in multilayer printed circuit boards. The process comprises two dip operations of the board in a Neutra-Clean and water solution which is continuously re-circulated. This is followed by subjecting the board to a heated de-ionized cascaded water feed, an ambient overflow de-ionized water rinse, and conveyorized air drying. The Neutra-Clean solution has the ability to penetrate down to the bottom of the via hole and to attract the free chloride ions from the etchant residue. The de-ionized water feed and rinse steps rinse out and remove the Neutra-Clean solution and any residuals formed by chemical reaction.

Abstract: A tool for removing from a housing a tri-lead cable having an end terminal removably retained in the housing and having a portion covered by an encapsulating film which extends partially into the housing. The tool comprises a hollow elongated body member having a spring-biased plunger mounted therein. A spring hook blade is attached to the plunger and extends out an open end of the body member. The spring blade is adapted to be inserted in between the housing and the encapsulating film to hook onto an edge of the film. Grasping means are provided on the body member for compressing the spring-biased plunger to retract the spring hook blade and remove the hooked tri-lead cable from the housing.

Abstract: A process is provided for making a multilayer integrated circuit substrate having improved via connection. A first layer M1 of chrome-copper-chrome is applied to a ceramic substrate and the circuits etched. A polyimide layer is then applied, cured, and developed and etched to provide via holes in the polyimide down to the M1 circuitry. The top chrome is now etched to expose the M1 copper in the via holes. A second layer M2 of copper-chrome is evaporated onto the polyimide at a high substrate temperature to provide a copper interface at the base of the vias having no visable grain boundaries and a low resistance. M2 circuitization is then carried out.

Abstract: A dot matrix printer is provided which has a row of hammer elements having horizontal impactor bars aligned at upper and lower levels and in partial overlapping relation with adjacent impactor bars. A row of print elements is also provided which alternately have horizontal upper and lower level non-overlapping impact receiving bars positioned opposite the hammer elements and in alignment with corresponding upper and lower impactor bars. Each print element has a dot print element on its opposite side and the row of print elements is mounted on a reciprocating shuttle. Means are provided for actuating the hammer elements whereby selected hammer impactor bars will impact the impact receiving bars to effect transverse deflection of the print elements to form dot impressions on a print medium.

Abstract: Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.

Abstract: An electronic assembly accomplishes module cooling and heat dissipation by directly impinging air flows each uniquely cooling a given module. The spent air is exhausted through channels defined between the modules in a manner such that the spent air has minimal impingement on adjacent modules.

Abstract: A pluggable module actuation and retention device comprising a spring housing fastened to a printed circuit board and having openings which contain a matrix of contact springs extending from said board. A bail retaining latch is fastened to the spring housing and an actuator bail is pivotally mounted on the spring housing and has an opening which overlies the openings in the spring housing. A module to be actuated and retained has a matrix of pins corresponding to the matrix of contact springs and is provided with actuator tabs. Actuator tab mating means are provided on the spring housing for engaging the module actuator tabs when a module is inserted through the opening in the actuator bail to align the matrix of pins with the matrix of contact springs. Camming means on the actuator bail are effective when the bail is pivoted in one direction to engage the actuator tabs and slide the module to move the matrix of pins on the module into engagement with the matrix of contact springs.

Abstract: A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro bellows containment vessel is filled with liquid to form a coolant vapor phase bubble which is centered within the vessel due to the surface energy characteristics of the fluid. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows across the bubble and condenses on the opposite side where heat is rejected and liquid is replenished to the evaporator section by flow through the continuous liquid film.

Abstract: A method for laser trimming of resistors which includes sputter depositing or vaporizing resistor material in a limited area but the resistor geometry and trimming location is designed to achieve a maximum resistor trimming range with a minimum substrate area occupied by the resistor. A cermet resistor is fabricated on a metallized ceramic substrate with the resistor having a low length to width ratio. A laser cut is used to provide resistor values greater than 250 ohms and up to 16000 ohms.

Abstract: This invention relates to a method and apparatus for wire bonding a variety of metals in the interconnection of semiconductor chips to electronic package substrate circuitries. A pair of electrically conducting bonding tip members are provided which are electrically isolated from one another and which are constructed of a material having a high resistivity. The wire is positioned beneath the tip members and a load is applied to the members to force the wire against a land on the substrate. A voltage source is provided to apply a voltage between the tip members. Activitation of the voltage source results in current flow through the tips and through the wire, in series, causing heating of the tip members and of the section of wire beneath them. Diffusion bonding will initiate before a significant amount of oxidation has had time to occur.

Abstract: A printed circuit board is provided with via holes and these holes are provided with a base coat of conductive metal, a coating of insulating material deposited on said base coat, and a second coat of conducting metal deposited on said insulating material. The metal coatings are interconnected to one or more surfaces of the board and the base coat is connected to at least one internal power, ground or signal plane. This via hole construction facilitates the making of engineering changes by simply deleting the interconnection between the metal coatings at the board surface and subsequently connecting the desired point to an alternate point on the circuit board.

Abstract: An electronic package assembly having means for providing direct interconnection for one or more planar electronic circuit boards with a nearly conventional card-on-board circuit package. Electrical interconnection between the card-on-board package and the planar boards is accomplished with the use of interposer cards that utilize a pin and spring blade contact system and printed circuitry to connect corresponding pins on the planar boards and the card-on-board package. The mechanical advantage necessary to overcome the spring contact force encountered in insertion and extraction of the planar boards is provided by a unique lever arrangement which latches and unlatches the planar boards.

Abstract: A card-on-board package assembly which comprises a printed circuit board, a board stiffener secured to the board, a card guide assembly fastened to the stiffener, and a plurality of printed circuit cards mounted in the guide assembly to make electrical contact with the board. The cards latch into position in the guide assembly and are connected into the board with a scissors-type movement by captive fastening means which fasten the cards to the stiffener. Individual cards may be easily replaced. The board, board stiffener, card guide, and card assembly is fastened to a gate or frame by captive fastening means and may be quickly and easily removed as a unit and replaced with another one.

Abstract: A ceramic substrate is provided with via holes and these holes are primed by first depositing a palladium coating to the inside surface of the holes and then depositing an iron film onto the palladium. The primed holes are then completely filled with copper to provide conductive connections between opposite surfaces of the substrate. On one side of the substrate, input/output connector pins are brazed to the copper fillings. On the other side, printed circuitry is applied to produce a circuit module.

Abstract: The variable resist laminator receives a heated panel between two identical vacuum bails and the leading edge of a web of photoresist material is placed on opposite sides of the panel simultaneously prior to feeding the panel and attached webs between a pair of application rolls. Identical cutter mechanisms shear the webs into sheets of the desired length and the length may be varied for different length panels. Vacuum means are provided for maintaining control of the trailing edges of the cut sheets until they are applied to the panel to prevent the formation of wrinkles or other defects due to premature application. Vacuum means is also provided for removing flakes or debris as the webs are sheared. A gated conveyor system feeds the panels and the conveyor system has means for controlling the operation of the vacuum bails, the cutters, and the application rolls.

Abstract: A method for producing a resin rich epoxy-glass prepreg and laminate wherein the epoxy-glass prepreg is given a first pass through an impregnation tower and impregnated with dicyandiamide cured brominated bisphenol type epoxy modified with a polyfunctional additive and advanced to 80-85% of complete cure. The prepreg is given a second pass through the tower and given a dip coating of, for example, brominated bisphenol A which is advanced to 80-85% of complete cure. The resulting prepreg serves as the outer sheet of a multi-layer printed circuit board and it has a resin rich surface necessary for chemical roughening and subsequent additive plating.