Abstract: A method for aligning a boundary condition temperature in a thermal processor utilizes an air temperature measurement. During the thermal process, air temperature measured along an interval series forms an air profile and provides a reference to which the boundary condition temperature may be aligned. A method for aligning a part temperature profile to the processor temperature profile uses the measured air temperature to adjust the part temperature profile, so as to be synchronized with the air temperature profile. These procedures may be used in conjunction with setpoint parameter prediction for attaining a target part temperature response.
Type:
Grant
Filed:
February 14, 2000
Date of Patent:
September 4, 2001
Assignee:
KIC Thermal Profiling
Inventors:
Philip C. Kazmierowicz, Steven Arthur Schultz