Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Type:
Grant
Filed:
November 10, 2000
Date of Patent:
January 27, 2004
Assignee:
Rodel Holdings, Inc.
Inventors:
John H. V Roberts, David B. James, Lee Melbourne Cook