Abstract: A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.
Type:
Grant
Filed:
October 8, 1997
Date of Patent:
January 2, 2001
Assignee:
Board of Trustees University of Arkansas
Inventors:
Ajay P. Malshe, Arzu M. Ozkan, William D. Brown