Abstract: A post-correlation nulling circuit (10) derives from a narrowband jammer a replica of the baseband jammer noise which is used to adaptively cancel the jammer noise waveform in the receiver baseband after PN processing, thus allowing the adaptive antenna spatial nulling to concentrate on canceling wideband jammers.

Abstract: A rotary pump that may be used in manual or automatic dispensing systems to dispense material such as epoxy or solder paste, and the like. The rotary pump has a feed screw shaft with fins disposed in a mixing chamber that mixes the epoxy or solder paste. Epoxy or solder paste disposed in a container is forced by air pressure from the container through a feed shaft to the mixing chamber. The feed screw shaft and fins are driven by a motor that rotates the shaft and fins to blend the epoxy or solder paste in the mixing chamber. The epoxy or solder paste is forced out of a dispensing tip onto an article by the rotary motion of the feed screw shaft. Therefore, mixing of the epoxy or solder paste is achieved just prior to the point of application. The rotary pump keeps the epoxy or solder paste thoroughly blended before it is dispensed.

Abstract: A monolithic flip chip microwave integrated circuit module formed using titanium coated copper circuitry and a processing method. A dam is formed on a substrate by forming a thin protective layer such as titanium or other metal on a copper layer formed on a surface of the substrate to which a monolithic microwave integrated circuit is to be attached. The protective layer is oxidized upon exposure to air. Vias or openings are then formed in the oxidized protective layer. Solder is disposed in the openings in the oxidized protective layer, and is confined to the openings while solder is reflowed to attach the integrated circuit to the substrate. The oxidized protective layer serves a dual function that provides both a solder dam and a protective coating for the underlying copper circuitry. Copper surfaces not covered by the oxidized protective layer may be environmentally protected by depositing a thin layer containing electroless plated nickel and electroless plated gold.