Abstract: In accordance with the present invention, an integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides.

Abstract: To attain high strength optical glass fibers, the glass preforms, from which the fibers are drawn, must generally be free of surface imperfections such as bubbles, and air lines. It has been discovered that these imperfections can be removed quickly and cleanly by contacting the preform surface with a substantial portion of the electrically conducting plasma region (the plasma fireball) extending from a plasma torch. Significantly, the surface material is substantially removed by vaporization, due to the extremely high plasma temperature (>9000.degree. C. at the plasma center) of the isothermal plasma torch. Though the temperatures in the tail of the plasma fireball are substantially less than at the plasma center, the temperatures are generally still several thousand degrees centigrade.

Abstract: Optical systems which include a particular type of wavelength-tunable semiconductor laser are disclosed. Significantly, the active layer of the laser includes a doping superlattice layer. Even more significantly, wavelength-tunability is achieved by nonuniformly, optically and/or electrically pumping the laser.