Patents Represented by Attorney Gonley, Rose & Tayon, P.C.
  • Patent number: 6018782
    Abstract: A single chip integrated circuit comprises a plurality of modules interconnected in an on-chip network. The modules are processors or memory devices or hybrids. An inter-module link provides an electrical path for data communication among the modules. The modules are connected to the inter-module link by inter-module ports, with at least one inter-module port coupled between an associated module and the inter-module link. The inter-module link electrically couples the inter-module ports and provides a communications pathway between the modules. Each inter-module port provides a common, universal interface to any of the modules, i.e., modules of different types are connectable to any inter-module port.
    Type: Grant
    Filed: July 14, 1997
    Date of Patent: January 25, 2000
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Alfred C. Hartmann