Abstract: A method and a circuit arrangement for protecting integrated circuits against electrostatic discharge (ESD) during and after packaging. An electrical connection between two integrated circuits is made by producing a low-impedance connection in the first integrated circuit, between a signal pad and a pad for a supply potential. The connection has a portion of reduced cross section, which is preferably severed by a current pulse applied after the arrangement has been assembled in a package and the connection has been electrically bonded to the second integrated circuit. The ESD protection during assembly requires no additional chip surface area.

Abstract: A guiding device for copies in a folder of a rotary printing machine includes a guiding material engageable with copies projecting into an outlet wedge formed between copy-guiding cylinders, the guiding material forming a surface of the guiding device facing towards the copies, the surface having a geometry that is changeable, and copy-guiding cylinders in combination with the guiding device, and a folder with copy-guiding cylinders and the guiding device, as well as a guiding device assembly including the guiding device.