Abstract: A lead free ferromagnetic article is disclosed. The article is a compacted composite having a heavy more dense constituent that is preferably ferrotungsten and a less dense second constituent that is either a metal alloy or a polymer. The ferromagnetic constituent is present in an amount sufficient to impart the article with ferromagnetism. The ferromagnetic property allows fragments of the article, such as a projectile, bullet or shaped charge liner to be separated from dirt or other environments.

Abstract: To hermetically seal an optically transparent ceramic or glass member to a metallic housing, an aperture with a diameter less than the diameter of the member is formed through the metallic housing. The member is then press-fit into the aperture, partially displacing metal from the walls of the aperture, forming an inner burr circumscribing the aperture. The walls of the aperture and the circumscribing burr are then coated with a second metal, preferably electroless nickel. The resultant seal maintains hermeticity following thermal cycling and is particularly suited for the manufacture of a hybrid electronic package having an optical or opto-electronic coupling.

Abstract: A fine silver alloy composition having at least about 99.5 weight percent silver, with the balance containing an element, or an oxide of an element, selected from the group consisting of: aluminum, antimony, cadmium, gallium, germanium, indium, lithium, manganese, magnesium, silicon, tin, titanium and zinc, the alloy composition having been formed by combining silver having a purity of at least about 99.90 weight percent with an element, or an oxide of an element, selected from the group, in a substantially non-oxidizing atmosphere. The alloy composition may be annealed in a substantially non-oxidizing atmosphere. The silver alloy composition may be hardened by internal oxidation. The composition is capable of being aged hardened to at least 136 percent of its annealed hardness, and this hardening may be irreversible. The composition may be resistant to tarnishing, and may have an aged hardness of at least about 48 VHN.

Abstract: There is provided a tin brass alloy having a grain structure that is refined by the addition of controlled amounts of both zinc and iron. Direct chill cast alloys containing from 1% to 4%, by weight of tin, from 0.8% to 4% of iron, from an amount effective to enhance iron initiated grain refinement to 35% of zinc and the remainder copper and inevitable impurities are readily hot worked. The zinc addition further increases the strength of the alloy and improves the bend formability in the "good way", perpendicular to the longitudinal axis of a rolled strip. Certain of the grain refined brass alloys are useful as semisolid forming feedstock.

Abstract: A system for testing the electrical conductivity of printed traces, on multiple surfaces, of a printed wiring board using non-contacting probes. The non-contact probes generate a plasma in a plasma generating chamber that is used to apply a voltage to the printed wiring board. A measurement circuit determines the magnitude of the voltage on the printed wiring board.

Abstract: A copper alloy having improved resistance to stress relaxation contains controlled additions of iron, phosphorous and magnesium. Free magnesium, in solid solution with the copper, increases the alloy's resistance to stress relaxation. Copper alloys of the invention retain at least 70% of the initial stress following exposure to a temperature of 105.degree. C. for 3000 hours, making the alloys particulary useful for electrical connector components.

Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ("y") of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.

Abstract: A method to disinfect a porous solid medium, such as soil, includes the steps of embedding a plurality of electrodes into the porous solid medium and applying a plurality of alternating current voltage pulses between the electrodes. The voltage pulses have a peak voltage of at least 10 kilovolts and are of an intensity and duration effective to generate a quantity of ozone. The ozone is produced in quantities sufficient to disinfect the porous solid medium.

Abstract: A reticle for a guidance seeker for spinning projectiles comprises a substrate; a pattern of a plurality of alternating light modulating structures, such as opaque and light transmitting, or light absorbing and light reflecting areas on the substrate such that an image of a target moving on the substrate will generate a plurality of pulses corresponding to the number of lines crossed by the image, the number of pulses increasing as the image moves outwardly from the center of the reticle; and a distinguishable, unambiguous, and singly periodic feature of the pattern, which is readily detectable every time the target image moves circumferentially, completing a full circle around the center of the reticle.

Abstract: An apparatus for and method of managing and distributing power from a supply of limited power is described. A plurality of outlets are connect to a plurality of power units. As additional outlets are used, the invention measures the amount of power drawn by the outlets. Outlets are enabled if the amount of measured power is less than a maximum amount of power available. Additional outlets not currently in use are disabled if the amount of measured power is greater than the maximum amount of power available.

Abstract: A shotshell having a hull with a protective barrier layer of fiber or other alternate material that prevents the hull from being in contact with the chamber. The protective layer may cover any portion of the exterior of the hull. The protective layer protects the plastic hull from the hot chamber of the barrel that would adversely affect the structural integrity or functioning of the shotshell. The protective material may be of precut size and thickness that when applied to the exterior of the hull will increase the diameter to reduce the clearance with the chamber and thereby resist sliding out of the chamber before the breech is closed. The protective layer may also have an adhesive surface disposed between the exterior surface of the hull and the protective layer to prevent the separation of the hull and the protective material.

Abstract: The present invention is directed to an electrical contact probe, comprising at least one fiber mounted in a holder, the at least one fiber having high electrical conductivity and high mechanical strength and made from a material selected from the group consisting of a conductive organic material and a conductive glass, the at least one fiber having a diameter in the range from 5 nanometers to 20 micrometers. The present invention is also directed to a device to measure various electrical parameters of a circuit.

Abstract: A copper alloy achieves high electrical conductivity, in excess of 70% IACS; high strength, ultimate tensile strength in excess of 75 ksi; good surface cosmetics; and good stampability, above 25% break, by controlled additions of magnesium, iron and phosphorous. There is a critical iron content to achieve both good stampability and high electrical conductivity and a critical phosphorous content to achieve high strength and relatively small metal phosphide particles. There is further, a critical relationship between the amount of iron and phosphorous. An additions of magnesium, in amounts of more than 0.03%, broadens the effective ratio of iron to phosphorous, widening the composition box of the alloys of the invention.

Abstract: An acoustic cannon has a plurality of acoustic sources with output ends symmetrically arranged in a planar array about a central point. Pressure pulses are generated in each acoustic source at substantially the same time. The pressure pulses exit the output ends as sonic pulses. Interaction of the sonic pulses generates a Mach disk, a non-linear shock wave that travels along an axis perpendicular to the planar array with limited radial diffusion. The Mach disk retains the intensity of the sonic pulses for a time and a distance significantly longer than that achievable from a single sonic source. The acoustic cannon is useful as a non-lethal weapon to disperse crowds or disable a hostile target.

Abstract: There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.

Abstract: The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles before solder ball fracture causes device failure. Among the means disclosed to reduce the bending moment are a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure and a package base with a stress accommodating depressed portion.

Abstract: Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.

Abstract: There is provided a lead-free projectile, such as a bullet or a ballistic shot, formed by liquid phase sintering or liquid phase bonding of a first particulate having a density greater than lead, a second, ductile, particulate having a melting temperature in excess of 400.degree. C. and a binder having a fluidity temperature that is less than the melting temperature of the second particulate. Unlike solid phase sintering that tends to produce articles having a porosity of about 20%, by volume, liquid phase sintering and liquid phase bonding achieve close to 0% porosity. Reducing the porosity level decreases the amount of high density, first particulate, required to achieve a density close to that of lead. Since the high density particulate tends to be the most expensive component of the projectile, this significantly reduces the cost of the projectile. The reduced porosity also allows for an increase in the amount of the second, ductile, component.

Abstract: Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.