Abstract: A method makes use of positional relationships in a memory stack between the frame pointer, such as the Extended Base Pointer (EBP) in Windows®-based systems, of a critical call initiating function making a call to a critical operating system (OS) function, the top of stack position, such as the Process Environment Block (PEB) in Windows® based systems, and the bottom of stack position, such as the Extended Stack pointer (ESP) in a Windows® based system, to detect and block buffer overflows.

Abstract: A computer-implemented method includes identifying a buffer overflow vulnerability in a vulnerable program including identifying a victim buffer creation site that created a victim buffer and identifying a vulnerability site that overflowed the victim buffer. A patch is created for the vulnerable program to prevent the vulnerability site from overflowing a potential victim buffer created by the victim buffer creation site. In this manner, the information obtained in identifying the buffer overflow vulnerability is used to automatically derive a patch that accurately seals the vulnerability, greatly reduces the false positive and negative rate, while at the same time shortens the response time to new threats.

Abstract: A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically connected to a circuit substrate having terminals disposed on a bottom side for connection to an external system. The die and substrate are encapsulated and vias are laser-ablated or otherwise formed through the encapsulation to terminals on the top surface of the substrate that provide a grid array mounting lands to which another grid array semiconductor package may be mounted. The bottom side of the vias may terminate and electrically connect to terminals on the substrate, terminals on the bottom of the semiconductor package (through terminals) or terminals on the top of the semiconductor die.

Abstract: A method for conversation like rendering of a stored audio information stream determines a first location in the stored audio information stream. The first location represents a point in time when the sound detection flag became active. The method next moves from the first location to a second location in the stored audio information stream. The second location is selected based upon a criterion to make playback of the stored audio information stream appear like actual conversation. Finally, the stored audio information stream is rendered starting with audio information stored at the second location.

Abstract: In accordance with one embodiment, a failure prognostic package includes a substrate having a first surface and an opposite second surface. An electronic component trace is coupled to the first surface. An electronic component is electrically coupled to the electronic component trace. A prognostic trace is coupled to the first surface of the substrate and is electrically isolated from the electronic component. A failure zone of the failure prognostic package includes a plurality of sides and a plurality of corners, wherein the prognostic trace is weaker at the failure zone than the electronic component trace. Failure of the prognostic trace does not cause failure of the failure prognostic package. However, failure of the prognostic trace provides advanced notice of failure of the failure prognostic package.

Abstract: A method and apparatus for automated bill of materials refactoring includes a computing system implemented process for automated bill of materials refactoring whereby historical bill of materials, inventory and sales data is scanned/searched to identify potential refactored sub-assemblies.

Abstract: A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are formed in the buildup dielectric material and filled with an electrically conductive material to form a buildup circuit pattern. The second carrier is patterned into a stiffener, which provides rigidity to the thin package.

Abstract: A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The metal layer interconnected with an internal substrate of the semiconductor package by blind vias laser-ablated through the encapsulation and filled with metal. The vias extend from the top surface to an internal package substrate or through the encapsulation to form bottom-side terminals. The metal layer may be formed by circuit patterns and/or terminals embedded within the encapsulation conformal to the top surface by laser-ablating channels in the top surface of the encapsulation and filling the channels with metal. A conformal coating may be applied to the top surface of the semiconductor package over the metal layer to prevent solder bridging to circuit patterns of the metal layer.

Abstract: A method and apparatus for displaying quantities of inventory items in multiple units of measure includes displaying an inventory item listing, including a desired quantity of the inventory item, on a user interface and/or display screen. The inventory item listing is then activated by a user through a user interface device within the context of the present transaction. Once the inventory item listing is activated, the quantity of the inventory item desired is displayed in a multiple units of measure display in multiple units of measure associated with the inventory item and within the context of the present transaction.

Abstract: A mobile authorization service may be implemented as a web-based service, hosted on an authorization service server, and may exchange messages with various computing devices of subscribers to the service, including mobile communication devices. The service may be implemented as a software application executing on the server, and may include a client portion executing on subscriber computer systems and/or mobile communication devices, or subscribers may interact with the service using a text messaging application or a web browsing application. The service may receive an authorization request from a subscriber and may send a request message to an approver. The approver may send a reply message to the service indicating an answer. After authenticating the reply, the service may provide a response to the requester. The service may store information regarding authorization requests and responses. An authorization service subscriber account may be configurable for an individual or corporate subscriber.

Abstract: A process for providing healthcare consumers advance notice of changes in network status of their healthcare service providers and/or medications whereby data indicating one or more healthcare service providers and/or medications used by a given healthcare consumer is obtained along with data indicating the given healthcare consumer's healthcare insurance plan. Data indicating all “in-network” healthcare service providers and/or medications for the given healthcare consumer's healthcare insurance plan is then obtained. The data indicating one or more healthcare service providers and/or medications used by a given healthcare consumer is then compared with the data indicating all in-network healthcare service providers and/or medications for the given healthcare consumer's healthcare insurance plan.

Abstract: Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of thermal expansion (CTE). Accordingly, the adhesive composition containing the silicon carbide filler exhibits improved heat dissipation performance and electrical performance due to high thermal conductivity and shows inhibition of delamination or cracking of semiconductor devices due to low CTE. The silicon carbide has high thermal conductivity, but is electrically non-conductive. Therefore, an electrically conductive adhesive can be obtained by additional incorporation of a silver (Ag) filler into the binder resin.

Abstract: A method and apparatus to reconfigure parameters for establishing a link with a new host after a computer is moved to a new location or a new network.

Abstract: The file context of a target file to be scanned is determined and the scan level for the file context is determined. Generally, the security risk for each file context is assessed, and the scan level appropriate for the security risk is associated with the file context. The target file is scanned at the scan level. Accordingly, a target file having a file context indicating that the file is a high security risk is scanned at a high scan level, i.e., is subject to a maximum-security scan. In this manner, high-level security is maintained. Conversely, a target file having a file context indicating that the file is a low security risk is scanned at a low scan level, i.e., is subject to a minimum-security scan or no scan at all. In this manner, high security is maintained while at the same time maximum performance is achieved.

Abstract: A heat spreader package includes a substrate having a first surface, first traces on the first surface of the substrate, and an electronic component having an inactive surface mounted to the first surface of the substrate. The electronic component further includes an active surface having bond pads. Bond wires electrically connect the bond pads to the first traces. An inverted pyramid heat spreader includes a first heatsink, a first heatsink adhesive directly connecting the first heatsink to the active surface of the electronic component inward of the bond pads, a second heatsink having an absence of active circuitry, and a second heatsink adhesive directly connecting a first surface of the second heatsink to the first heatsink. The second heatsink adhesive is a dielectric directly between the bond wires and the second heatsink that prevents inadvertent shorting between the bond wires and the second heatsink.

Abstract: Contextual data is gathered about a user's known location and/or about a user's expected location and generates contextual indicators based on at least a portion of the gathered contextual data. The contextual indicators are provided to one or more relying parties, such as an anti-fraud system to allow the anti-fraud system to more effectively determine the validity of transactions associated with the user, such as credit card transactions associated with the user's credit card.

Abstract: A method of fabricating a bumped chip package includes forming a first seed layer on a dielectric layer, the dielectric layer comprising a dielectric layer opening exposing a substrate terminal of a substrate, the first seed layer being formed within the dielectric layer opening and on the substrate terminal. A circuit pattern is plated on the first seed layer, wherein an exposed portion of the first seed layer is exposed from the circuit pattern. The exposed portion of the first seed layer is removed by laser-ablation. By using a laser-ablation process, a chemical etching process is avoided thus eliminating the need to treat or dispose of chemical etching hazardous waste. Further, circuit pattern width erosion and undercut of the circuit pattern associated with a chemical etching process are avoided.

Abstract: Various embodiments of a system and method for generating a display configured to graphically indicate a state of a series of events are described. The system and method may include a display generator configured to generate display data that defines a display configured to indicate the state of a series of events. The display generator may create display data that defines a display configured to graphically indicate such events in a chronological manner such that the user may easily view the current state of the particular process. The display data may define a display that graphically indicates multiple events from multiple entities, such as events associated with a same episode. The displays defined by the display data may include one or more visual elements that graphically indicate an event that includes the transfer of an asset between a source entity and a destination entity.

Abstract: Various embodiments of a method and apparatus for a portable medical alert mechanism stores health information on a portable electronic device and provides the health information to a health professional. In some embodiments, the health information may include information about a health condition, a health history, current medications, current medication dosages, allergies, or instructions. The health information may be on the portable electronic device and/or downloaded from a web-based application. In some embodiments, the health information may be selected and transferred to the portable electronic device by the system user from an external computer system. The health information stored on the portable electronic device may be periodically updated. The system user (or the portable electronic device) may have an indication of the presence of the health information on the portable electronic device (e.g., on a bracelet).

Abstract: An echo reduction method stores a received audio information stream. A sound detection flag is activated following detection of locally generated sound. Output based on the received audio information stream is muted in response to the activating the sound detection flag. Rendering status of the received audio information stream is saved, in response to the activating the sound detection flag, to reduce loss of audio information. At least a portion of the stored received audio information stream is rendered following inactivation of the sound detection flag.