Abstract: An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier includes at least one semiconductor chip mounted on one major surface thereof and at least one decoupling capacitor mounted on an opposite surface thereof. The decoupling capacitor is electrically coupled to input/output contacts of the semiconductor chip. The carrier is then mounted on the second level electronic package so that one semiconductor chip is positioned within a respective opening and the circuitry formed on the carrier is coupled to the circuitry formed on the second level package thereby interconnecting the semiconductor chip to the electronic package.

Abstract: A "lookback" carry function is implemented in a binary incrementor. In contrast to conventional lookahead carry functions, the present "lookback" carry function implements an actual carry during the incrementing operation. After the carry function has been implemented at each register position, a subsequent determination is made as to whether each carry function was a valid one and should have been carried out. With respect to any carry functions which were not valid, subsequent circuitry will eliminate such carries to leave the appropriate carry pattern in each position of the register. In order for a carry to be considered valid, the incrementation of all bits of a lower order must have resulted in a carryout.