Patents Represented by Attorney Harold Wells
  • Patent number: 7670798
    Abstract: The present invention describes semi- and fully-automated methods and reagents therefor for the assay and analysis of body fluid samples, particularly non-blood samples. The methods and reagents are especially useful for the assay and analysis of cerebrospinal fluid (CSF) samples. The reagent compositions sphere and fix all cells in the sample in suspension. Reported results can include red blood cell (RBC) and white blood cell (WBC) counts, WBC differential values, cell-by-cell volumes and dry-mass concentrations.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: March 2, 2010
    Assignee: Siemens Healthcare Diagnostics Inc.
    Inventors: Leonard Ornstein, Gena Fischer, David Zelmanovic, Pamela Elsins, Jolanta Kunicka, Michael J. Malin
  • Patent number: 5672675
    Abstract: Oligomers of particular usefulness in coatings are vinyl ether terminated polyester oligomers which include 4,8-bis(hydroxymethyl) tricyclo?5.2.1.0.sup.2,6 !decane (BHTD).
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: September 30, 1997
    Assignee: AlliedSignal, Inc.
    Inventors: George David Green, James Ronald Snyder, Raymond John Swedo
  • Patent number: 5629249
    Abstract: This invention relates to a black glass fiber which is resistant to oxidation at a temperature of about 1350.degree. C. and has the empirical formula SiC.sub.x O.sub.y where x ranges from about 0.5 to about 2.0 and y ranges from about 0.5 to about 2.0. This invention also relates to a process for preparing a black glass fiber comprising reacting a silicon hydride group with a silicon olefinic group in the presence of a hydrosilylation catalyst to give a cyclosiloxane polymer. The polymer is then spun into fiber, hardened and then pyrolyzed to give a black glass fiber.
    Type: Grant
    Filed: April 25, 1988
    Date of Patent: May 13, 1997
    Assignee: AlliedSignal Inc.
    Inventor: Roger Y. Leung
  • Patent number: 5626774
    Abstract: A permanent solder mask is applied to the surface of a printed circuit board using a copper foil carrier. The solder mask preferably is one or two layers of a thermosetting resin e.g. epoxy resin. Selected circuit features are exposed by etching away portions of the copper foil and removing the underlying thermosetting resin. Then, the remaining copper foil is removed, leaving the solder mask on the surface of the printed circuit board.
    Type: Grant
    Filed: December 11, 1995
    Date of Patent: May 6, 1997
    Assignee: AlliedSignal Inc.
    Inventor: James R. Paulus