Abstract: A blow mould apparatus for moulding plastic preforms into plastic containers with a first mould carrier element and a second mould carrier element which is swivelable about a connecting axis in relation to the first mould carrier element, wherein the mould carrier elements cooperate such that in a closed state of the blow mould apparatus they form in their interior a cavity in which the plastic preforms can be expanded into plastic containers, and with a locking device which locks the first mould carrier element in relation to the second mould carrier element in order to hold the blow mould apparatus at least temporarily in a closed state, wherein the locking device has at least one locking element which is arranged on a mould carrier element, is mobile and cooperates with the other mould carrier element to lock the mould carrier elements and wherein the locking device comprises a mobile actuation element, the movement of which is coupled at least temporarily with a movement of the locking element, the actuat

Abstract: A Schottky photodiode includes a semiconductor layer and a conductive film provided in contact with the semiconductor layer. The conductive film has an aperture and a periodic structure provided around said aperture for producing a resonant state by an excited surface plasmon in a film surface of the conductive film by means of the incident light to the film surface. The photodiode detects near-field light that is generated by at the interface between the conductive film and semiconductor layer the excited surface plasmon. The aperture has a diameter smaller than the wavelength of the incident light.

Abstract: Apparatus and methods for automatically staining or treating multiple tissue samples mounted on slides are provided, in which the slides and reagent bottles are held in fixed position, and the reagent and wash solutions brought to the slides.

Abstract: An optical semiconductor module has a housing having an opening, and an optical semiconductor element is set in the housing. An optical fiber that penetrates the opening is disposed. The optical fiber is allowed to perform optical transmission between the optical semiconductor element and elements arranged outside the housing. The opening is sealed with a photo-curing resin, and a transparent plate is arranged between the photo-curing resin and the outside of the housing.