Patents Represented by Attorney HDLS IPR Service
  • Patent number: 7766074
    Abstract: A heat-dissipating device having an air-guiding structure includes a heat-conducting seat, a fin assembly, at least one heat pipe for serially connecting to the fin assembly and the heat-conducting seat, and a fan assembly unit. The fin assembly is positioned above the heat-conducting seat and formed by arranging a plurality of heat-dissipating fins at intervals. As a result, airflow paths are formed between each heat-dissipating fin. The fan assembly unit is laterally provided at one side of the fin assembly. A space for lateral flow is formed between the heat-conducting seat and the fin assembly. The other side of the fin assembly is provided with an air-guiding member. The air-guiding member has a guiding space for laterally communicating with the space. The air blown by the fan assembly unit can pass through the space and is received by the air-guiding member. Then, the air flow is guided to the portions to be heat-dissipated by the air-guiding member.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: August 3, 2010
    Assignees: CPUMATE Inc., Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Ken Hsu, Wen-Jung Liu
  • Patent number: 7759588
    Abstract: A thin keypad assembly with a keypad panel of a smooth surface, a mist surface or a lines layer includes an elastic layer, a carrier and a keypad layer. The elastic layer includes a plurality of support portions, and each support portion has a protrusion. The carrier is installed on a surface of the elastic layer, and the joint surface of the carrier and the elastic layer sequentially includes a ground color layer, a function color layer and a font color layer. The keypad layer has a holder disposed on a surface of the carrier, and a plurality of protruding or flat keycaps are disposed on the holder, and a smooth surface is formed on the surface of the keycap, and the surface of the holder is a mist surface, or the surfaces of both keycap and holder are a lines layer.
    Type: Grant
    Filed: April 25, 2007
    Date of Patent: July 20, 2010
    Assignee: Ichia Technologies, Inc.
    Inventor: Chih-Ho Hsu
  • Patent number: 7760521
    Abstract: A half-bridge resonant converter includes: a primary winding; a secondary winding having a first and a second end and a central point; a first electronic switch; a second electronic switch; a first power-storage element; a second power-storage element; and a load having a first and a second end. Wherein, the first end of said the secondary winding serially connects with said the first electronic switch and the first power-storage element, and the second end of said the secondary winding serially connects with said the second electronic switch and the second power-storage element, and the first end of said the load connects simultaneously with said the first power-storage element and the second power-storage element, and the second end connects with the central point of the secondary winding.
    Type: Grant
    Filed: January 11, 2007
    Date of Patent: July 20, 2010
    Assignee: Hipro Electronics Co.
    Inventor: Ming-Ho Huang
  • Patent number: 7755282
    Abstract: A method is performed for the fabrication of LED and its structure. The LED is capable of emitting uniform white light and includes a substrate, an LED die, a holding frame and fluorescent substance where the holding frame is of hollow shape. The LED contains a die emitting blue light, and the fluorescent substance is a yellow phosphor. As the LED die is mounted on the substrate, the holding frame is seated on the die, and a bond wiring is performed. The holding frame is filled with the fluorescent substance in a uniform distribution on the die to form a layer of fluorescence. Finally the structure of the LED is accomplished as the packaging is completed.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: July 13, 2010
    Assignee: Edison Opto Corporation
    Inventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Kuo-Shih Hsu, Pao-Shen Chen
  • Patent number: 7749781
    Abstract: A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.
    Type: Grant
    Filed: June 2, 2007
    Date of Patent: July 6, 2010
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Jonnie Chuang, Miko Huang