Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.

Abstract: A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102).

Abstract: A light emitting apparatus including a circuit board (10), at least one light emitting chip (20), an integrated optical cover (30) and a fluorescent layer (40). The light emitting chip (20) is arranged on the circuit board (10). The integrated optical cover (30) has a peripheral wall (31), a top wall (32) and a light guiding post (33). The peripheral wall (31) is arranged around the circuit board (10). The top wall (32) is arranged on the peripheral wall (31). The light guiding post (33) extends from the top wall (32) toward the light emitting chip (20). The light guiding post (33) includes a recess portion (332). The light emitting chip (20) is accommodated in the recess portion (332). The fluorescent layer (40) is arranged between the recess portion (332) and the light emitting chip (20). By using the recess portion (332) and the light emitting chip (20) cooperatively to confine the fluorescent layer (40), the thickness thereof can be controlled to be consistent.

Abstract: A transmission apparatus includes a wire cable and at least one connector. The wire cable has an insulating external layer, a differential signal line group, an AC power line group, and a metal shielding layer. The insulating external layer covers the differential signal line group, the AC power line group, and the metal shielding layer. The differential signal line group has a plurality of signal transmission lines. The AC power line group has a plurality of power lines. The metal shielding layer isolates the differential signal line group and the AC power line group. Each connector has an insulating external case and a plurality of conductive terminals. The insulating external case covers the conductive terminals. Each conductive terminal has a pin and the pins of the conductive terminals are electrically connected to the signal transmission lines, the power lines, and the metal shielding layer.

Abstract: The emergency light of the invention includes a base (1), a lighting module (2), a rechargeable battery (3) and a retractable support (4). The base (1) has a back (11) with a trough (111). The lighting module (2) is installed in the base (1) and electrically connects a lighting device (21) and a circuit board (22). The rechargeable battery (3) is installed in the base (1) and electrically connects the circuit board (22). The retractable support (4) is pivotally connected to the back (11) and received in the trough (111).

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: An optical lens includes a main body having an outer convex surface and a bottom surface opposite to the outer convex surface. The bottom surface has an inner concave surface which is concave toward the outer convex surface. The outer convex surface and the inner concave surface cooperatively form two positive lens portions and a negative lens portion. The positive lens portions and the negative lens portion are arranged in a triangular configuration.

Abstract: A cable connector joint fastening structure includes a male connector, a female connector, and a fastener. The male connector includes a male terminal body with a male terminal joint, a freely rotating screw sleeve locked around the external periphery of the male terminal joint. The female connector includes a female terminal body with a female terminal joint, and an insert space formed in the female terminal joint for inserting the male terminal joint, and the screw sleeve is screwed and coupled to the female terminal joint. The fastener includes a pivot portion formed at an external side of the female connector, and a locking arm pivotally installed onto the pivot portion, extended towards the male terminal body, disposed across the screw sleeve, and locked to the male connector.

Abstract: A method for increasing semiconductor device effective operation area, comprising following steps: depositing first conductive layer on the substrate; using laser for scribing a plurality of the first scribe lines on the first conductive layer, where the scribe lines are scribed on the bottom of the first conductive layer; depositing a plurality of the semiconductor material layers on the first conductive layer and in the plurality of the first scribe lines; using laser for scribing a plurality of the second scribe lines on the semiconductor material layer, where the scribe lines are scribed on the bottom of the semiconductor material layer, each second scribe line is comprised of a plurality of the second pores; depositing a second conductive layer on the semiconductor material layer and in the plurality of the first scribe lines and the plurality of the second scribe lines; using laser for scribing a plurality of the third scribe lines on the second conductive layer, where the scribe lines are scribed on th

Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Abstract: The transformer module of the invention includes an isolation transformer having a primary winding with a first tap and a secondary winding with a second tap. A protection circuit is electrically connected to the first tap and the second tap. The protection circuit includes at least one protective element.

Abstract: An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly.

Abstract: A screw-less fixing assembly for an interface card having a fixing support includes a frame, a movable cover module and an elastic member. The frame has an I/O opening. One side of the I/O opening is provided with an accommodating space. A long plate of the fixing support is positioned to correspond to the I/O opening, and a short plate of the fixing support is received in the accommodating space. The movable cover module is mounted in the accommodating space. The elastic member has an elastic protrusion positioned to correspond to the short plate of the fixing support. The movable cover module is moved to drive the elastic protrusion to tightly fix the short plate of the fixing support to the frame. With this arrangement, the interface card can be rapidly detached from the frame or attached thereto without using screws.

Abstract: A multi-interfaces connector includes a plurality of housings, a circuit board and a casing. The circuit board has a soldering portion, and the circuit board has a plurality of tongue plates extended from one side of the soldering portion. The tongue plates are separately arranged through the plurality of housings. The tongue plates respectively have a plurality of first conductive pins, a plurality of second conductive pins and a plurality of third conductive pins. The casing has a hollow case body which includes a plurality of through holes. The plurality of housings are arranged with the circuit board and installed in the casing. Therefore, the multi-interfaces connector is capable of being inserted with several transmission lines which have different types of insertion plug.

Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.

Abstract: A remote communication method of a network includes a main controller and a plurality of control units, wherein each control unit is serially connected to the main controller and the control unit at next stage through a transmission terminal and a transmitter. Each control unit receives the data sent from the main controller and identifies the received data as one of a first, a second and a third packet. If it is the first packet and the main controller attempts to read data from each control unit, a switch in the control unit is turned on and a response data is transmitted to the main controller. If it is the second packet and a connection index is equal to a target unit address, then data is written to a corresponding single control unit. If it is the third packet and a target unit address is zero, data is written to all control units.