Patents Represented by Attorney, Agent or Law Firm Hebbert L. Lerner
  • Patent number: 6454956
    Abstract: A method for structuring at least one layer to be structured. First, a mask is applied to the layer and the layer is structured using the mask. After the structuring step, the mask is then removed, while leaving behind redepositions of the material of the layer. The redepositions of the material of the layer are removed by mechanical polishing or chemical-mechanical polishing.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: September 24, 2002
    Assignee: Infineon Technologies AG
    Inventors: Manfred Engelhardt, Volker Weinrich