Patents Represented by Attorney Herbert Price

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  • Oxymethylene polymer molding compositions having enhanced resistance to black speck formation
    Patent number: 4666995
    Abstract: The black speck formation which occurs during the compounding and molding of admixtures of oxymethylene polymers and polyamides having a melting or softening point below that of the oxymethylene polymer can be reduced by adding the polyamide to the oxymethylene polymer as a dispersion of the polyamide in a carrier resin which is inert to the oxymethylene polymer and has a melting or softening point below that of the oxymethylene polymer. The polyamide comprises less than about 50 weight percent of the dispersion.
    Type: Grant
    Filed: May 15, 1986
    Date of Patent: May 19, 1987
    Assignee: Celanese Corporation
    Inventors: Andrew Auerbach, Kavilipalayam Natarajan