Abstract: A molded circuit board has an aperture wherein a contact member is flexibly carried by a living hinge. Conductor traces are plated upon the contact member, the living hinge, and the circuit board. The conductor traces form contacts on the contact member which are electrically connected to the conductor traces on the circuit board. A mating connector, having resilient contacts, is inserted into the aperture, folding back the contact member. The resilient contacts engage the contacts on the contact member. Another embodiment includes dual contact members hinged on opposing sides of an aperture. A further embodiment has a contact member which is folded up and inserted into a mating connector. In the above embodiments the contact members are molded with thin breakable portions of material holding the contact members in planes of the circuit boards. The present invention is formed from a polymeric material including one of polypropylene, polyethylene, and nylon.

Abstract: A logic function block having an output signal potential sensing function is substituted for each of logic function blocks of which fault conditions cannot be detected on the basis of predetermined input/output signal combinations for determining whether or not the semiconductor integrated circuit device operates correctly. Probe lines and sense lines are connected only to the logic function blocks having output signal potential sensing function. The probe lines are driven from a probe line driver, and a sense line receiver reads out signals on the sense lines. Thus, without reducing fault detecting efficiency, the areas of an active region and a wiring region required for forming a fault detecting arrangement can be reduced.