Abstract: Improved, planarized semiconductor structures are described. They are prepared by a method which involves the creation of a series of subminimum (i.e., 50 to 500 Angstroms thick) silicon pillars extending vertically upward from the base of a wide trench, and oxidizing the pillars. When the substrate is covered with a conformal CVD oxide, the pillars prevent the formation of a single deep depression above the trench.
Type:
Grant
Filed:
October 27, 1993
Date of Patent:
September 26, 1995
Assignee:
International Business Machines Corporation