Abstract: A method and apparatus for recognizing a gesture input on a display screen of a computer system. A method of recognizing an ellipse gesture comprises the steps of receiving a stroke input by a user onto a computer screen, smoothing the stroke by reducing the number of points that represent the stroke, determining whether the smoothed stroke includes at least a predetermined minimum number of points, and, if so, calculating angles between adjacent segments of the smoothed stroke and calculating derivatives of the angles. It is determined if the stroke substantially represents an ellipse by utilizing the angles and the derivatives of the angles. The method preferably includes selecting an ink object on the screen if the ink object is substantially overlapped by the smoothed stroke.

Abstract: An integrated circuit chip and flat capacitor assembly are connected with short bonding wires to reduce electrical noise. A flat chip capacitor is coupled to the chip and includes a first electrode, a second electrode and a dielectric layer disposed between the electrodes. The ground and power bonding pads of an integrated circuit chip are coupled to a number of terminals arranged in a row near the outer edge of the capacitor, where each of the terminals is coupled to one of the electrodes. The terminals of the capacitor are connected to a number of package leads of a lead frame or a other integrated circuit package. The invention includes embodiments in which the chip is placed on top of the capacitor, the capacitor is placed on top of the chip, and a flex circuit of a micro ball grid array is placed on a capacitor which is positioned on a chip.

Abstract: A double walled insulating jacket having a vacuum zone and a getter composition within the zone. The getter composition is barium oxide and a second oxide of palladium, ruthenium, rhodium, osmium, iridium, and/or silver and mixtures thereof. A process for producing this composition is disclosed.

Abstract: The present invention provides a data transfer unit interposed between a computer and a peripheral device for executing data exchange by a handshaking process based on a signal level. The invention also provides a method of supplying power to the data transfer unit. The data transfer unit includes a first power circuit and a second power circuit. The first power circuit receives an electric current via a diode D6 connected in a forward direction to a signal line RTS used for handshaking and generates a predetermined positive voltage of +12 volts. The second power circuit receives an electric current via a diode D1 connected in a reverse direction to the signal line RTS used for handshaking and generates the predetermined positive voltage of +12 volts. An auxiliary power of -12 volts is supplied from a data output signal line TXD in a printer.

Abstract: A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.

Abstract: A coating system for detecting the presence of contaminants carried by a fluid that is applied as a coating on a workpiece. A tube guides the fluid along a flow path to the workpiece. A light source illuminates the fluid along at least a portion of the flow path, and this light is scattered by any contaminants present in the fluid. Light scattered by the contaminant particles is more intense than light scattered by the other fluid particles, and this brighter scattered light is detected by a light detector positioned adjacent to the fluid flow path. If one or more contaminant particles is detected in the fluid, a warning signal can be given and/or the flow of fluid can be stopped. This coating system is particularly well suited for use in a spin-on coating process that applies a liquid, such as a photoresist material or a dielectric material, to a semiconductor wafer or other workpiece that is secured to a rotating turntable.

Abstract: An apparatus for enabling an IC pin to function in a dual mode, which apparatus includes a first switch for coupling the IC pin to an input terminal when the IC pin operates in an input mode, and a charging circuit for sourcing current to the IC pin during a charging cycle of a timer mode. The inventive apparatus further includes a discharging circuit for sinking current from the IC pin during a discharging cycle of the timer mode. In one embodiment, the inventive apparatus further includes a comparator for generating an activation signal, the activation signal being activated when a potential at the IC pin equals or exceeds a predefined voltage in the timer mode. In another embodiment, the comparator is disabled during the input mode.

Abstract: In accordance with the present invention, a method for forming solder bumps begins with a wafer that has been patterned with bond pad areas. A plurality of distinct metal layers are then deposited over the wafer. Subsequently, solder is deposited by way of plating through a mask over the metal layers in the bond pad areas. After the removal of the mask, the metal layers outside of the soldered areas are etched using a dilute phosphoric acid solution, which includes phosphoric acid, acetic acid, hydrogen peroxide, and deionized water. By the use of this solution, the metal layers are removed without attacking the soldered areas. Thus, a pattern of solder bumps are formed. The metal layers include distinct layers of aluminum, nickel-vanadium, and copper. Alternatively, the aluminum layer is eliminated.

Abstract: A coloring apparatus comprises a transfer head C having a heating element elastically protruding from an apparatus body 1, a tape accommodating portion B, and a tape feeding portion A having a winding up shaft 17, etc., which are incorporated within the apparatus body 1. A using method comprises, holding the apparatus body 1, pressing the transfer head C on the copied image of the xerographic copy, and heating by a heating element. Next, the apparatus body 1 is moved as the transfer head C is pressed onto the copied image, whereby the colored donor layer is peeled off from the transfer tape to stick the colored donor layer onto the copied image on the xerographic copy.

Abstract: The invention relates to an integrated getter device essentially consisting of at least one evaporable getter device and at least one non-evaporable getter device, wherein the different getter devices circumscribe areas at least partially superimposed or coincident, lying on essentially parallel or coincident planes and preferably arranged in a coaxial way.

Abstract: A unitary heat sink including a planar contact portion for contacting the top of an IC. The heat sink is constructed from a material having a thermal conductivity of at least 150 watts per meter Degree Kelvin (W/m.degree.K.) but preferably is constructed from aluminum having a conductivity of 221 (W/m.degree.K.). A number of leg portions extend from the contact portion such that each leg portion has a distal end. The leg portions, being made of the same material as the contact portion, are configured to have a sufficient resiliency such that deformations of the leg portions provide a spring force in the range of 5 to 16 lbs against the top of the IC. A method for dissipating heat from an integrated circuit includes the steps of forming a unitary heat sink from a heat sink material, where the heat sink includes a contact portion and a number of integral, spring leg portions.

Abstract: An improved fluid distribution head for a plasma processing system characterized by a non-planar dispersion plate provided with a plurality of apertures formed therethrough, and a mechanism for flowing a process gas through the apertures of the dispersion plate. The non-planar dispersion plate is preferably provided with a concave, spherical portion having a radius of curvature of at least four feet. The mechanism for flowing the process gas through the apertures includes an enclosure defining a chamber which communicates with the dispersion plate, a gas inlet communicating with the chamber, and a source of process gas coupled to the gas inlet. The fluid distribution head preferably forms a part of a complete plasma processing system including a wafer pedestal and an R.F. generator coupled to the pedestal to form a plasma between the dispersion plate and the wafer from the process gas flowing from the dispersion plate.

Abstract: A method and apparatus for manipulating inked objects in a computer system includes the steps of displaying a first recognized object on a computer screen and displaying a first ink object on the screen which was previously recognized as the first recognized object. The first ink object is edited to create a second ink object, and the second ink object is recognized as a second recognized object. The first recognized object is then replaced with the second recognized object. The method also preferably includes a step of selecting the first recognized object, and the first ink object is displayed in response to the selection step. A preferred method of selecting the first recognized object is to move a stylus within a predetermined distance or bounding box of the first recognized object.

Abstract: A bar clamp having a locking pliers, toggle action clamping mechanism is herein disclosed. The locking pliers includes a fixed handle, a movable handle, and a toggling linkage arrangement therebetween for toggling the locking pliers from a first open position to a second clamped position. An extension bar is connected at one end to the fixed handle. The bar clamp includes an adjustable outer clamping jaw slidably connected to the extension bar. The outer clamping jaw includes disengagable locking mechanism for disengagably locking the outer clamping jaw in any given position along the length of the extension bar. The bar clamp also includes an inner clamping jaw connected to the toggling linkage arrangement such that when the locking pliers are toggled into the clamped position the inner clamping jaw is caused to move toward the adjustable outer clamping jaw.

Abstract: A lead frame having layered conductive planes is disclosed for use in semiconductor devices. The lead frame includes a plurality of long leads each having a lead tip and a plurality of short leads. Electrically conductive layers are attached to the long leads around such that they don't cover the tips of the long leads and are radially inward of the short leads. The conductive layers are insulated from the long lead and each other by adhesive insulating layers. In a preferred embodiment, the top conductive layer has a smaller width than the bottom conducting layer and is positioned to expose an inner and outer ledge on the bottom conducting layer. The exposed outer ledge allows bonding to the shorter leads. The use of shorter leads decreases the amount of inductance in the leads. The conductive layers also may act as capacitors. In one embodiment of the present application the short leads may correspond to ground and/or power leads.

Abstract: An integrated circuit device including a substrate, a gate structure formed over the substrate, a channel formed in the substrate under the gate, a lightly-doped drain-side LDD region formed in the substrate adjacent to a drain-side of the channel (preferably by a LATID process), a drain region formed in the substrate near to the drain-side LDD region, and a drain-side DDD region substantially separating the drain-side LDD region from the drain region. Preferably, the integrated circuit device is symmetrically formed such that a lightly-doped source-side LDD region is formed in the substrate adjacent to a source-side of the channel (again preferably by a LATID process), a source region is formed in the substrate near to the source-side LDD region, and a source-side DDD region is formed in the substrate to substantially separate the source-side LDD region from the source region. Further preferably, the DDD regions substantially isolate the source and drain from a bulk portion of the substrate.

Abstract: A method and apparatus for measuring film thickness and sheet resistance. A four-point probe engages the surface of a film, and a measuring apparatus outputs a voltage waveform which induces a current in the outer probes of the four point probe and through the surface of the film. The two inner probes measure a voltage in the film created by the current. The current created by the voltage waveform and the voltage created across the inner probes are measured for each voltage level of the waveform. A sheet resistance of the film is calculated by taking a least square fit of the measured current and voltage and calculating the slope of the least square line fit. The sheet resistance is proportional to the slope of the least square line. The thickness of the film is calculated by dividing the film resistivity by the calculated sheet resistance.

Abstract: A camera has a two lens group zoom system composed of a front lens group and a rear lens group, and a home position check apparatus of the rear lens group driven by a stepping motor. The home position check apparatus is so arranged that a detection as to if the rear lens group is located at the home position is started only when the rear lens group reaches the predetermined position before the home position. Before the rear lens group reaches the predetermined position, only the movement of rear lens group to the home position is carried out but the home position check of rear lens group is not.