Abstract: To optimize a discharge current flowing in each of discharge channels for performing linear sequential scan of a display cell, a panel 0 has a laminated structure in which a display cell having signal electrodes D arranged in columns and a plasma cell having discharge channels (K,A) arranged in rows are laminated to each other. Pixels 1 are defined in a matrix at positions where the signal electrodes D cross the discharge channels (K,A). A vertical drive circuit 2 repeatedly performs field scans in each of which pixels 1 are selected in a row-sequential manner by sequentially applying drive pulses each to the signal channels (K,A) for generating plasma discharges. A horizontal drive circuit 3 applies image signals each to the signal electrodes D, to write the image signals in the selected pixels 1. The vertical drive circuit 2 includes a detecting resistance 14 for detecting a discharge state of each discharge channel (K,A) for each field scan.

Abstract: It is an object of the present invention to provide a solid-state image sensing device with a vertical shutter structure allowing the size of the solid-state image sensing device with ease.An electric-charge exhausting unit is provided on the same side of a sensor array comprising a plurality of sensor units arranged to form a straight line as an electric-charge transferring unit wherein the electric-charge exhausting unit comprising an electric-charge exhaust drain having a shape resembling an island and an electric-charge exhausting gate with a bent shape surrounding the electric-charge exhaust drain is provided in such a way that the electric-charge exhausting unit is in contact with a first region of a read gate, and only one electric-charge exhausting unit is provided for each pair of sensor units adjacent to each other.

Abstract: An apparatus for drying and heating sludge to remove pathogens and to dry the sludge into a powder form which includes an elongate housing having an endless chain conveyor inside. The conveyor having outwardly extending scrapers for slowly urging solid material from one end of the housing to the other. The housing is heated to heat the sludge and a fan removes moisture laden air from within the housing. The scrapers are provided in rows and include specialized scrapers including plows, inclined paddles, and round rods to sequentially split, redirect, split, and redirect again the stream of sludge being urged through the housing. By so mixing the stream of sludge, cold and hot spots are avoided during heating and a build up of sludge on a floor of the housing is avoided.

Abstract: A method of adhering a film to a panel of a cathode-ray tube, comprised of adhering a light transmitting type functional film to the surface of a panel glass while interposing an ultraviolet ray-curable resin layer therebetween, then bringing the film into tight contact with the panel glass from the inside of one end portion toward that one end portion, then bringing the film into tight contact with the panel glass toward the other end. Further, when bringing the film into tight contact with the panel, by heating by irradiating the front surface of the panel by ultraviolet rays, the resin protruding from the periphery of the film is cured, the work process is shortened, and the handling is facilitated.

Abstract: A self-supporting layer of n-doped monocrystalline silicon is stripped from a substrate wafer of n-doped, monocrystalline silicon by electrochemical etching for manufacturing a solar cell. Holes are formed in the substrate wafer by electrochemical etching, particularly in a fluoride-containing, acidic electrolyte wherein the substrate wafer is connected as an anode. When a depth of the holes that essentially corresponds to the thickness of the self-supporting layer is reached, the process parameters of the etching are modified such that the self-supporting layer is stripped as a consequence of the holes growing together. The solar cell is manufactured from the self-supporting layer, and the method can be applied repeatedly on the same substrate wafer for stripping a plurality of self-supporting layers.