Abstract: A method and an apparatus for connecting a semiconductor chip to a carrier system, wherein the semiconductor chip that is already detached but is still situated in the wafer union and that is held on a self-adhesive foil is detached therefrom and move onto a prescribed connecting location on the carrier system and connected thereto. The placement of the semiconductor chip onto the carrier system involves considerably less expenditure of time and capital outlay than the prior art systems. The carrier system is provided with a joining material at the prescribed connecting locations. The wafer union on the self-adhesive foil is aligned such that the surface of a semiconductor chip to be connected lies opposite the location of the carrier system that is provided with the joining material. The semiconductor chip in the wafer union is brought to a spacing of .ltoreq.0.